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参数资料
型号： BX80532KC3000D
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 3000 MHz, MICROPROCESSOR
文件页数： 52/129页
文件大小： 1640K
代理商： BX80532KC3000D
Intel Xeon Processor with 512 KB L2 Cache
Datasheet
29
4. Overshoot is defined as the absolute value of the maximum voltage.
5. Undershoot is defined as the absolute value of the minimum voltage.
6. Ringback Margin is defined as the absolute voltage difference between the maximum Rising Edge Ringback
and the maximum Falling Edge Ringback.
7. Threshold Region is defined as a region entered around the crossing point voltage in which the differential
receiver switches. It includes input threshold hysteresis.
8. The crossing point must meet the absolute and relative crossing point specifications simultaneously.
9. VHavg can be measured directly using "Vtop" on Agilent* scopes and "High" on Tektronix* scopes.
10.
V
CROSS is defined as the total variation of all crossing voltages as defined in note 2.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies and cache sizes.
2. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
3. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
4. VIH and VON may experience excursions above VCC. However, input signal drivers must comply with the
signal quality specifications in Chapter 3.0.
5. Refer to the Intel Xeon Processor with 512 KB L2 Cache Signal Integrity Models for I/V characteristics.
6. The VCC referred to in these specifications refers to instantaneous VCC.
7. VOL_MAX of 0.450 V is guaranteed when driving into a test load as indicated in Figure 5, with RTT enabled.
8. Leakage to VCC with pin held at 300 mV.
9. Leakage to VSS with pin held at VCC.
Table 9. TAP and PWRGOOD Signal Group DC Specifications
NOTES:.
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies and cache sizes.
2. All outputs are open drain
Table 8. AGTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes
1,7
VIH
Input High Voltage
1.10 * GTLREF
VCC
V2, 4, 6
VIL
Input Low Voltage
0.0
0.90 * GTLREF
V
3, 6
VOH
Output High Voltage
N/A
VCC
V4, 6
IOL
Output Low Current
N/A
VCC /
(0.50 * RTT_min + RON_min)
= 50
mA
6
IHI
Pin Leakage High
N/A
100
A
9
ILO
Pin Leakage Low
N/A
500
A
8
RON
Buffer On Resistance
7
11
5, 7
Symbol
Parameter
Min
Max
Unit
Notes 1, 2
VHYS
TAP Input Hysteresis
200
300
8
VT+
TAP input low to high
threshold voltage
0.5 * (VCC + VHYS_MIN) 0.5 * (VCC + VHYS_MAX)5
VT-
TAP input high to low
threshold voltage
0.5 * (VCC - VHYS_MAX)0.5 * (VCC - VHYS_MIN)5
VOH
Output High Voltage
N/A
VCC
V3, 5
IOL
Output Low Current
40
mA
6, 7
IHI
Pin Leakage High
N/A
100
A
10
ILO
Pin Leakage Low
N/A
500
A
9
RON
Buffer On Resistance
8.75
13.75
4
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