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参数资料
型号： BX80532KC3000D
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 3000 MHz, MICROPROCESSOR
文件页数： 75/129页
文件大小： 1640K
代理商： BX80532KC3000D
Contents
Datasheet
5
Figures
1
Typical VCCIOPLL, VCCA and VSSA Power Distribution ........................................................ 18
2
Phase Lock Loop (PLL) Filter Requirements ............................................................................19
3
Intel Xeon Processor with 512 KB L2 Cache Voltage-Current (VID =1.5V)........................27
4
Intel Xeon Processor with 512 KB L2 Cache Voltage-Current (VID = 1.525V)................... 28
5
Electrical Test Circuit................................................................................................................. 37
6
TCK Clock Waveform................................................................................................................ 37
7
Differential Clock Waveform......................................................................................................38
8
Differential Clock Crosspoint Specification................................................................................ 38
9
Front Side Bus Common Clock Valid Delay Timing Waveform................................................. 39
10
Front Side Bus Source Synchronous 2X (Address) Timing Waveform .....................................39
11
Front Side Bus Source Synchronous 4X (Data) Timing Waveform........................................... 40
12
Front Side Bus Reset and Configuration Timing Waveform...................................................... 41
13
Power-On Reset and Configuration Timing Waveform ............................................................. 41
14
TAP Valid Delay Timing Waveform ........................................................................................... 42
15
Test Reset (TRST#), Async GTL+ Input, and PROCHOT# Timing Waveform ......................... 42
16
THERMTRIP# to VCC Timing ................................................................................................... 42
17
SMBus Timing Waveform.......................................................................................................... 43
18
SMBus Valid Delay Timing Waveform ...................................................................................... 43
19
Example 3.3 VDC/SM_VCC Sequencing..................................................................................44
20
BCLK[1:0] Signal Integrity Waveform........................................................................................ 46
21
Low-to-High Front Side Bus Receiver Ringback Tolerance for AGTL+ and Asynchronous GTL+
Buffers ...................................................................................................................................... 47
22
High-to-Low Front Side Bus Receiver Ringback Tolerance for AGTL+ and Asynchronous GTL+
Buffers ...................................................................................................................................... 48
23
Low-to-High Front Side Bus Receiver Ringback Tolerance for PWRGOOD TAP Buffers ........ 48
24
High-to-Low Front Side Bus Receiver Ringback Tolerance for PWRGOOD and TAP Buffers . 49
25
Maximum Acceptable Overshoot/Undershoot Waveform ......................................................... 55
26
INT-mPGA Processor Package Assembly Drawing (Includes Socket) .....................................57
27
INT-mPGA Processor Package Top View: Component Placement Detail................................ 58
28
INT-mPGA Processor Package Drawing ..................................................................................59
29
INT-mPGA Processor Package Top View: Component Height Keep-in ................................... 60
30
INT-mPGA Processor Package Cross Section View: Pin Side Component Keep-in ................ 60
31
INT-mPGA Processor Package: Pin Detail ............................................................................... 61
32
IHS Flatness and Tilt Drawing................................................................................................... 62
33
Processor Top-Side Markings ...................................................................................................64
34
Processor Bottom-Side Markings.............................................................................................. 64
35
Processor Pin Out Diagram: Top View...................................................................................... 65
36
Processor Pin Out Diagram: Bottom View ................................................................................ 66
37
Processor with Thermal and Mechanical Components - Exploded View .................................. 95
38
Processor Thermal Design Power vs Electrical Projections for VID = 1.500V .......................... 96
39
Processor Thermal Design Power vs Electrical Projections for VID = 1.525V .......................... 97
40
Thermal Measurement Point for Processor TCASE.................................................................. 98
41
Stop Clock State Machine ....................................................................................................... 100
42
Logical Schematic of SMBus Circuitry .................................................................................... 104
43
Mechanical Representation of the Boxed Processor Passive Heatsink for 3 GHz processors
................................................................................................................................................115
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相关代理商/技术参数
参数描述
BX80532KC3000H 制造商:Intel 功能描述:MPU XEON NETBURST 64-BIT 0.13UM 3GHZ - Boxed Product (Development Kits)
BX80532KE2000D 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2GHZ - Boxed Product (Development Kits)
BX80532KE2000DU 制造商:Intel 功能描述:XEON 2.0GHZ 533FSB 1U - Boxed Product (Development Kits)
BX80532KE2400DSL73L 制造商:Intel 功能描述:
BX80532KE2400E 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits)
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