参数资料
型号: BX80532KE2000D
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2000 MHz, MICROPROCESSOR, XMA
文件页数: 25/102页
文件大小: 1464K
代理商: BX80532KE2000D
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
29
3.0
Mechanical Specifications
The Intel Xeon Processor with 533 MHz Front Side Bus uses the Flip Chip Micro-Pin Grid
Array (FC-mPGA) package containing the processor die covered by an integrated heat spreader
(IHS) Mechanical specifications for the processor are given in this section. See Section 1.1 for
terminology definitions. Figure 7 provides a basic assembly drawing and includes the components
which make up the entire processor. Package dimensions are provided in Table 14.
The Intel Xeon processor with 533 MHz Front Side Bus utilizes a surface mount 604-pin zero-
insertion force (ZIF) socket for installation into the baseboard. See the 604-Pin Socket Design
Guidelines for further details on the processor socket.
For Figure 9 through Figure 13, the following notes apply:
1. Unless otherwise specified, the following drawings are dimensioned in millimeters.
2. All dimensions are not tested, but are guaranteed by design characterization.
3. Figures and drawings labelled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are Reference Dimensions.
4. Drawings are not to scale.
Note:
applies to Intel Xeon processor in the FC-mPGA2 package.
1. Integrated Heat Spreader (IHS)
2. Processor die
3. FC-mPGA2 package
4. Land side Capacitors
5. Package Pin
Figure 7.
FC-mPGA2 Processor Package Assembly Drawing
1
2
3
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