- 您现在的位置：买卖IC网 > PDF目录210366 > BX80532KE2000D (INTEL CORP) 32-BIT, 2000 MHz, MICROPROCESSOR, XMA PDF资料下载
参数资料
| 型号： | BX80532KE2000D |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2000 MHz, MICROPROCESSOR, XMA |
| 文件页数： | 95/102页 |
| 文件大小： | 1464K |
| 代理商： | BX80532KE2000D |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页当前第95页第96页第97页第98页第99页第100页第101页第102页
92
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
7.4
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
7.4.1
Boxed Processor Cooling Requirements
The boxed processor will be directly cooled with a passive heatsink. For the passive heatsink to
effectively cool the boxed processor, it is critical that sufficient, unimpeded, cool air flow over the
heatsink of every processor in the system. Meeting the processor's temperature specification is a
function of the thermal design of the entire system, and ultimately the responsibility of the system
integrator. The processor temperature specification is found in Chapter 5.0. It is important that
system integrators perform thermal tests to verify that the boxed processor is kept below its
maximum temperature specification in a specific baseboard and chassis.
At an absolute minimum, the boxed processor heatsink will require 500 Linear Feet per Minute
(LFM) of cool air flowing over the heatsink. The airflow must be directed from the outside of the
chassis directly over the processor heatsinks in a direction passing from one retention mechanism
to the other. It also should flow from the front to the back of the chassis. Directing air over the
passive heatsink of the boxed Intel Xeon Processor with 533 MHz Front Side Bus can be done
with auxiliary chassis fans, fan ducts, or other techniques.
It is also recommended that the ambient air temperature outside of the chassis be kept at or below
35 °C. The air passing directly over the processor heatsink should not be preheated by other system
components (such as another processor), and should be kept at or below 45 °C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator. The processor
temperature specification is found in Chapter 5.0.
相关PDF资料 |
PDF描述 |
|---|---|
| BX80532KC1900E | 1900 MHz, MICROPROCESSOR |
| BU-61582D0-290S | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61582D0-300K | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61582D1-391Q | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
| BU-61582D1-410S | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80532KE2000DU | 制造商:Intel 功能描述:XEON 2.0GHZ 533FSB 1U - Boxed Product (Development Kits) |
| BX80532KE2400DSL73L | 制造商:Intel 功能描述: |
| BX80532KE2400E | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits) |
| BX80532KE2400EU | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits) |
| BX80532KE2667D | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.66GHZ - Boxed Product (Development Kits) |
发布紧急采购，3分钟左右您将得到回复。