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参数资料
| 型号： | BX80532KE2000D |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2000 MHz, MICROPROCESSOR, XMA |
| 文件页数： | 71/102页 |
| 文件大小： | 1464K |
| 代理商： | BX80532KE2000D |
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70
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
5.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains between the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 42. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 42 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 6.3. To ensure maximum flexibility
for future requirements, systems should be designed to the Flexible Motherboard Guidelines
(FMB), even if a processor with a lower thermal dissipation is currently planned. In all cases, the
Thermal Monitor feature must be enabled for the processor to remain within specification
NOTE:
1. Intel recommends that thermal solutions be designed utilizing the Thermal Design Power values. Refer to the
Intel Xeon Processor Thermal Design Guidelines
.
2. TDP values are specified at the point on Vcc_max loadline corresponding to Icc_TDP.
3. Systems must be designed to ensure that the processor is not subjected to any static Vcc and Icc
combination wherein Vcc exceeds Vcc_max at specified Icc. Please refer to the loadline specifications in
Chapter 2.0.
Table 42. Processor Thermal Design Power
Core
Frequency
L2
Cache
(KB)
L3
Cache
(MB)
Processor
Signature
Thermal
Design Power1
(W)
Maximum
Power
(W)
Minimum
TCASE
(°C)
Maximum
TCASE
(°C)
Notes
2GHz
512
0F27h
or
0F29h
58
66
5
70
2,3
2.40 GHz
512
65
75
5
74
2,3
2.66 GHz
512
72
83
5
74
2,3
2.80 GHz
512
74
86
5
75
2,3
3.06 GHz
512
85
101
5
73
2,3
2.40 GHz
512
0F25h
77
86
5
72
2,3
2.66 GHz
512
77
86
5
72
2,3
2.80 GHz
512
77
86
5
72
2,3
3.06 GHz
512
1
87
102
570
2,3
3.20 GHz
512
1
92
110
5
71
2,3
3.20 GHz
512
2
92
110
5
71
2,3
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相关代理商/技术参数 |
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|---|---|
| BX80532KE2000DU | 制造商:Intel 功能描述:XEON 2.0GHZ 533FSB 1U - Boxed Product (Development Kits) |
| BX80532KE2400DSL73L | 制造商:Intel 功能描述: |
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| BX80532KE2400EU | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits) |
| BX80532KE2667D | 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.66GHZ - Boxed Product (Development Kits) |
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