参数资料
型号: BX80532KE2000D
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2000 MHz, MICROPROCESSOR, XMA
文件页数: 32/102页
文件大小: 1464K
代理商: BX80532KE2000D
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
35
Figure 13 details the flatness and tilt specifications for the IHS of the Intel Xeon processor with
533 MHz Front Side Bus, respectively. Tilt is measured with the reference datum set to the bottom
of the processor interposer.
3.2
Processor Package Load Specifications
Table 15 provides dynamic and static load specifications for the processor IHS. These mechanical
load limits should not be exceeded during heat sink assembly, mechanical stress testing, or
standard drop and shipping conditions. The heat sink attach solutions must not induce continuous
stress onto the processor with the exception of a uniform load to maintain the heat sink-to-
processor thermal interface. It is not recommended to use any portion of the processor interposer as
a mechanical reference or load bearing surface for thermal solutions.
NOTES:
1. This specification applies to a uniform compressed load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. These parameters are based on design characterization and not tested.
4. Dynamic loading specifications are defined assuming a maximum duration of 11ms.
5. The heatsink weight is assumed to be one pound. Shock input to the system during shock testing is assumed
to be 50 G’s. AF is the amplification factor.
Figure 13.
IHS Flatness and Tilt Drawing
0.080
Table 15. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Static
50
lbf
1, 2, 3
Dynamic
50 + 1 lb * 50G input * 1.8 (AF)
= 140
lbf
1, 2, 4, 5
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