- 您现在的位置：买卖IC网 > PDF目录298893 > BX805555080A (INTEL CORP) 64-BIT, MICROPROCESSOR, BGA771 PDF资料下载
参数资料
| 型号： | BX805555080A |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, MICROPROCESSOR, BGA771 |
| 封装： | LGA-771 |
| 文件页数： | 36/104页 |
| 文件大小： | 3690K |
| 代理商： | BX805555080A |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页当前第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页
Dual-Core Intel Xeon Processor 5000 Series Datasheet
37
Mechanical Specifications
3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to either
the topside or land-side of the package substrate. See Figure 3-4 for keepout zones.
3.3
Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
mechanical stress testing or standard drop and shipping conditions. The heatsink
attach solutions must not include continuous stress onto the processor with the
exception of a uniform load to maintain the heatsink-to-processor thermal interface.
Also, any mechanical system or component testing should not exceed these limits. The
processor package substrate should not be used as a mechanical reference or load-
bearing surface for thermal or mechanical solutions. Please refer to the Dual-Core
Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for further
details.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3.
Loading limits are for the LGA771 socket.
4.
Dynamic compressive load applies to all board thickness.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The
dynamic portion of this specification in the product application can have flexibility in specific values, but the
ultimate product of mass times acceleration should not exceed this dynamic load.
7.
Transient bend is defined as the transient board deflection during manufacturing such as board assembly
and system integration. It is a relatively slow bending event compared to shock and vibration tests.
8.
For more information on the transient bend limits, please refer to the MAS document entitled
Manufacturing with Intel Components using 771-land LGA Package that Interfaces with the Motherboard
via a LGA771 Socket.
9.
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for
information on heatsink clip load metrology.
Table 3-1.
Package Loading Specifications
Parameter
Board
Thickness
R
Min
Max
Unit
Notes
Static
Compressive Load
Apply for all
board thickness
from 1.57 mm
(0.062”) to
2.54 mm
(0.100”)
25mm
<R<
45mm
80
18
133
30
N
lbf
1, 2, 3, 9,
10, 11,
12, 13
R>45mm
80
18
311
70
N
lbf
Dynamic
Compressive Load
NA
311 N (max static
compressive load) +
222 N dynamic loading
70 lbf (max static
compressive load) +
50 lbf dynamic loading
N
lbf
1, 3, 4, 5,
6
Transient Bend
Limits
1.57 mm
0.062”
NA
750
ε
1,3,7,8
2.16 mm
0.085”
700
2.54 mm
0.100”
650
相关PDF资料 |
PDF描述 |
|---|---|
| BX805555030P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX80557E2140 | MICROPROCESSOR, PBGA775 |
| BXM80526B600128 | 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495 |
| BXM80526B700128 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80526B700 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX805565120P S L9RY | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box |
| BX805565130A S LAGC | 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET |
| BX805565140P S LABN | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5140 RISC 64-Bit 65nm 2.33GHz 1.35V/1.5V 771-Pin FCLGA6 Box |
| BX805565148A S LABH | 制造商:Intel 功能描述:MPU Xeon |
| BX805565160A S L9RT | 制造商:Intel 功能描述:MPU Xeon? Processor 5160 RISC 64-Bit 65nm 3GHz 1.35V/1.5V 771-Pin FCLGA6 Box |
发布紧急采购，3分钟左右您将得到回复。