参数资料
型号: BX805555080A
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, MICROPROCESSOR, BGA771
封装: LGA-771
文件页数: 76/104页
文件大小: 3690K
代理商: BX805555080A
Dual-Core Intel Xeon Processor 5000 Series Datasheet
73
Thermal Specifications
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-5 for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (Refer to Section 6.2 for details on TCC activation).
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-6 for
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Figure 6-2. Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles
40
45
50
55
60
65
70
0
10
203040
50
607080
90
100
Pow e r [W]
Tc
a
s
e
[
C
]
Therm al Profile B
Y = 0.260*x + 42.3
Thermal Profile A
Y = 0.203*x + 41.7
TCASE_M AX is a therm al solution design point. In actuality, units w ill not significantly exceed
TCASE_M AX_A due to TCC activation.
TCASE_M AX_B@ TDP
TCASE_M AX_A@ TDP
40
45
50
55
60
65
70
0
10
203040
50
607080
90
100
Pow e r [W]
Tc
a
s
e
[
C
]
Therm al Profile B
Y = 0.260*x + 42.3
Thermal Profile A
Y = 0.203*x + 41.7
TCASE_M AX is a therm al solution design point. In actuality, units w ill not significantly exceed
TCASE_M AX_A due to TCC activation.
TCASE_M AX_B@ TDP
TCASE_M AX_A@ TDP
Table 6-5.
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A
Table
Power (W)
TCASE_MAX (° C)
Power (W)
TCASE_MAX (° C)
P_profile_min_A=40.9
50.0
80
57.9
45
50.8
85
59.0
50
51.9
90
60.0
55
52.9
95
61.0
60
53.9
65
54.9
70
55.9
75
56.9
相关PDF资料
PDF描述
BX805555030P 64-BIT, MICROPROCESSOR, BGA771
BX80557E2140 MICROPROCESSOR, PBGA775
BXM80526B600128 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495
BXM80526B700128 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
BXM80526B700 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
相关代理商/技术参数
参数描述
BX805565120P S L9RY 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box
BX805565130A S LAGC 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET
BX805565140P S LABN 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5140 RISC 64-Bit 65nm 2.33GHz 1.35V/1.5V 771-Pin FCLGA6 Box
BX805565148A S LABH 制造商:Intel 功能描述:MPU Xeon
BX805565160A S L9RT 制造商:Intel 功能描述:MPU Xeon? Processor 5160 RISC 64-Bit 65nm 3GHz 1.35V/1.5V 771-Pin FCLGA6 Box