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参数资料
型号： BX805555080A
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 64-BIT, MICROPROCESSOR, BGA771
封装： LGA-771
文件页数： 78/104页
文件大小： 3690K
代理商： BX805555080A
Dual-Core Intel Xeon Processor 5000 Series Datasheet
75
Thermal Specifications
Notes:
1.
Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 6-8 for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and
may result in permanent damage to the processor.
3.
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environment implementation details.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (TCASE) specified in Table 6-2,
Table 6-3, Table 6-5, and Table 6-6 are measured at the geometric top center of the
processor integrated heat spreader (IHS). Figure 6-4 illustrates the location where
Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile
Thermal Profile
40
45
50
55
60
65
70
0
10
2030
40
5060
70
80
90
100
Pow e r [W]
T
c
as
e
[
C
]
Thermal Profile
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Thermal Profile
40
45
50
55
60
65
70
0
10
2030
40
5060
70
80
90
100
Pow e r [W]
T
c
as
e
[
C
]
Thermal Profile
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Table 6-8.
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table
Power (W)
TCASE_MAX (° C)
Power (W)
TCASE_MAX (° C)
P_profile_min_B=29.6
50.0
75
61.8
35
51.4
80
63.1
40
52.7
85
64.4
45
54.0
90
65.7
50
55.3
95
67.0
55
56.6
60
57.9
65
59.2
70
60.5
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