参数资料
型号: FDMA1024NZ
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET N-CH DUAL 20V 6-MICROFET
产品目录绘图: MicorFET 2x2, SC-75 Dual
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 5A
开态Rds(最大)@ Id, Vgs @ 25° C: 54 毫欧 @ 5A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 7.3nC @ 4.5V
输入电容 (Ciss) @ Vds: 500pF @ 10V
功率 - 最大: 700mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA1024NZDKR
Ma y 2010
FDMA1024NZ
Dual N-Channel PowerTrench ? MOSFET
20 V, 5.0 A, 54 m ?
Features
Max r DS(on) = 54 m ? at V GS = 4.5 V, I D = 5.0 A
Max r DS(on) = 66 m ? at V GS = 2.5 V, I D = 4.2 A
Max r DS(on) = 82 m ? at V GS = 1.8 V, I D = 2.3 A
Max r DS(on) = 114 m ? at V GS = 1.5 V, I D = 2.0 A
HBM ESD protection level = 1.6 kV (Note 3)
Low pr o file - 0.8 mm ma x imum - in the new package
MicroFET 2x2 mm
RoHS Compliant
Free from halogenated compounds and ant imony
oxides
General Description
This device is designed specifically as a single package solution
for d u al switching r e quirements in cellular handset and other
ultra-portable applications. I t featu r es tw o independe n t
N-Channel MOSFETs with low on-state resistance for minimum
conduction losses.
The Micr o FET 2X2 packa g e offers exceptio n al th e rmal
performance for its physical size and is well suited to linear mode
applications.
Applications
Baseband Switch
Loadswitch
DC-DC Conversion
PIN 1
S1
G1
D2
S1
1
6
D1
D1
D2
G1
2
5
G2
D1
G2 S2
D2
3
4
S2
MicroFET 2x2
MOSFET Maximum Ratings T A = 25 °C unless otherwise noted
Symbol
Parameter
Ratings
Units
V DS
V GS
I D
P D
T J , T STG
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Pulsed
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
(Note 1a)
(Note 1a)
(Note 1b)
20
±8
5.0
6.0
1.4
0.7
–55 to +150
V
V
A
W
° C
Thermal Characteristics
R θ JA
Thermal Resistance, Junction to Ambient
(Note 1a)
86 (Single Operation)
R θ JA
R θ JA
R θ JA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1b)
(Note 1c)
(Note 1d)
173 (Single Operation)
69 (Dual Operation)
151 (Dual Operation)
°C/W
Package Marking and Ordering Information
Device Marking
024
Device
FDMA1024NZ
Package
MicroFET 2X2
Reel Size
7 ”
Tape Width
8 mm
Quantity
3000 units
?2010 Fairchild Semiconductor Corporation
FDMA1024NZ Rev.B 4
1
www.fairchildsemi.com
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