参数资料
型号: FDMA1029PZ
厂商: Fairchild Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: IC MOSFET P-CH DUAL MICROFET 2X2
产品培训模块: High Voltage Switches for Power Processing
产品目录绘图: MicorFET 2x2, SC-75 Dual
标准包装: 1
系列: PowerTrench®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3.1A
开态Rds(最大)@ Id, Vgs @ 25° C: 95 毫欧 @ 3.1A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 4.5V
输入电容 (Ciss) @ Vds: 540pF @ 10V
功率 - 最大: 700mW
安装类型: 表面贴装
封装/外壳: 6-WDFN 裸露焊盘
供应商设备封装: 6-MicroFET(2x2)
包装: 标准包装
产品目录页面: 1609 (CN2011-ZH PDF)
其它名称: FDMA1029PZDKR
May 2009
FDMA1029PZ
Dual P-Channel PowerTrench ? MOSFET
General Description
This device is designed specifically as a single package
solution for the battery charge switch in cellular handset
and other ultra-portable applications. It features two
independent P-Channel MOSFETs with low on-state
resistance for minimum conduction losses. When
connected in the typical common source configuration,
bi-directional current flow is possible.
The MicroFET 2x2 package offers exceptional thermal
performance for its physical size and is well suited to
linear mode applications.
PIN 1
tm tm
Features
x
? –3.1 A, –20V. R DS(ON) = 95 m : @ V GS = –4.5V
R DS(ON) = 141 m : @ V GS = –2.5V
x
? Low profile – 0.8 mm maximum – in the new package
MicroFET 2x2 mm
? x HBM ESD protection level > 2.5kV (Note 3)
? x RoHS Compliant
? Free from halogenated compounds and antimony
oxides
S1 G1
D2
D1
D2
S1
G1
1
2
6
5
D1
G2
D1 G2 S2
MicroFET 2x2
D2
3
4
S2
T A =25 C unless otherwise noted
Absolute Maximum Ratings
o
Symbol
V DS
V GS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Ratings
–20
r 12
Units
V
V
I D
Drain Current
– Continuous
– Pulsed
(Note 1a)
–3.1
–6
A
P D
Power Dissipation for Single Operation
(Note 1a)
1.4
W
(Note 1b)
0.7
T J , T STG
Operating and Storage Junction Temperature Range
–55 to +150
q C
Thermal Characteristics
R T JA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
86 (Single Operation)
R T JA
R T JA
R T JA
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
(Note 1b)
(Note 1c)
(Note 1d)
173 (Single Operation)
69 (Dual Operation)
151 (Dual Operation)
q C/W
Package Marking and Ordering Information
Device Marking
029
Device
FDMA1029PZ
Reel Size
7’’
Tape width
8mm
Quantity
3000 units
? 2009 Fairchild Semiconductor Corporation
FDMA1029PZ Rev.B3(W)
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