参数资料
型号: GS81302D08E-333
厂商: GSI TECHNOLOGY
元件分类: SRAM
英文描述: 16M X 8 DDR SRAM, 0.45 ns, PBGA165
封装: 15 X 17 MM, 1 MM PITCH, FPBGA-165
文件页数: 18/34页
文件大小: 536K
代理商: GS81302D08E-333
GS81302D08/09/18/36E-375/350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 4/2011
25/34
2011, GSI Technology
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Instruction Register
ID Code Register
Boundary Scan Register
0
1
2
0
31 30 29
1
2
0
Bypass Register
TDI
TDO
TMS
TCK
Test Access Port (TAP) Controller
108
1
0
Control Signals
JTAG TAP Block Diagram
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
相关PDF资料
PDF描述
GS81302D37GE-400I 4M X 36 DDR SRAM, 0.45 ns, PBGA165
GS81302D10E-300I 16M X 9 DDR SRAM, 0.45 ns, PBGA165
GS81302T09E-375T 16M X 9 DDR SRAM, 0.45 ns, PBGA165
GS81302T18E-350T 8M X 18 DDR SRAM, 0.45 ns, PBGA165
GS81302T10E-350I 16M X 9 DDR SRAM, 0.45 ns, PBGA165
相关代理商/技术参数
参数描述
GS81302D10E-300 制造商:GSI Technology 功能描述:GS81302D10E-300 - Trays
GS81302D10E-333 制造商:GSI Technology 功能描述:GS81302D10E-333 - Trays
GS81302D10E-333I 制造商:GSI Technology 功能描述:GS81302D10E-333I - Trays
GS81302D10E-350 制造商:GSI Technology 功能描述:165 FBGA - Bulk
GS81302D10E-375 制造商:GSI Technology 功能描述:GS81302D10E-375 - Trays