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参数资料
| 型号： | GS81302D08E-333 |
| 厂商： | GSI TECHNOLOGY |
| 元件分类： | SRAM |
| 英文描述： | 16M X 8 DDR SRAM, 0.45 ns, PBGA165 |
| 封装： | 15 X 17 MM, 1 MM PITCH, FPBGA-165 |
| 文件页数： | 8/34页 |
| 文件大小： | 536K |
| 代理商： | GS81302D08E-333 |
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Thermal Impedance
Package
Test PCB
Substrate
θ JA (C°/W)
Airflow = 0 m/s
θ JA (C°/W)
Airflow = 1 m/s
θ JA (C°/W)
Airflow = 2 m/s
θ JB (C°/W)
θ JC (C°/W)
165 BGA
4-layer
16.4
13.4
12.4
8.6
1.2
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
GS81302D08/09/18/36E-375/350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.04 4/2011
16/34
2011, GSI Technology
HSTL I/O DC Input Characteristics
Parameter
Symbol
Min
Max
Units
Notes
DC Input Logic High
VIH (dc)
VREF + 0.1
VDDQ + 0.3
V
1
DC Input Logic Low
VIL (dc)
–0.3
VREF – 0.1
V
1
Notes:
1. Compatible with both 1.8 V and 1.5 V I/O drivers.
2. These are DC test criteria. DC design criteria is VREF ± 50 mV. The AC VIH/VIL levels are defined separately for measuring timing
parameters.
3. VIL (Min)DC = –0.3 V, VIL(Min)AC = –1.5 V (pulse width ≤ 3 ns).
4. VIH (Max)DC = VDDQ + 0.3 V, VIH(Max)AC = VDDQ + 0.85 V (pulse width ≤ 3 ns).
HSTL I/O AC Input Characteristics
Parameter
Symbol
Min
Max
Units
Notes
AC Input Logic High
VIH (ac)
VREF + 200
—
mV
2,3
AC Input Logic Low
VIL (ac)
—
VREF – 200
mV
2,3
VREF Peak-to-Peak AC Voltage
VREF (ac)
—
5% VREF (DC)
mV
1
Notes:
1. The peak-to-peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF.
2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other.
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.
相关PDF资料 |
PDF描述 |
|---|---|
| GS81302D37GE-400I | 4M X 36 DDR SRAM, 0.45 ns, PBGA165 |
| GS81302D10E-300I | 16M X 9 DDR SRAM, 0.45 ns, PBGA165 |
| GS81302T09E-375T | 16M X 9 DDR SRAM, 0.45 ns, PBGA165 |
| GS81302T18E-350T | 8M X 18 DDR SRAM, 0.45 ns, PBGA165 |
| GS81302T10E-350I | 16M X 9 DDR SRAM, 0.45 ns, PBGA165 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| GS81302D10E-300 | 制造商:GSI Technology 功能描述:GS81302D10E-300 - Trays |
| GS81302D10E-333 | 制造商:GSI Technology 功能描述:GS81302D10E-333 - Trays |
| GS81302D10E-333I | 制造商:GSI Technology 功能描述:GS81302D10E-333I - Trays |
| GS81302D10E-350 | 制造商:GSI Technology 功能描述:165 FBGA - Bulk |
| GS81302D10E-375 | 制造商:GSI Technology 功能描述:GS81302D10E-375 - Trays |
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