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| 型号： | MAX16068ETI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/41页 |
| 文件大小： | 0K |
| 描述： | IC SYSTEM MANAGER 6CH 28-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 六路电源监控器 |
| 电源电压： | 2.8 V ~ 14 V |
| 电流 - 电源： | 2.8mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 供应商设备封装： | 28-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
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6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
ABSOLUTE MAXIMUM RATINGS
V CC to GND ............... ……………………………….-0.3V to +15V
MON_, SCL, SDA, A0 to GND ................................-0.3V to +6V
EN, TCK, TMS, TDI to GND ....................................-0.3V to +4V
TDO to GND ............................................-0.3V to (V DBP + 0.3V)
RESET, GPIO_
(configured as open-drain) to GND. ....................-0.3V to +6V
RESET, GPIO_ (configured as push-pull)
to GND .................................................-0.3V to (V DBP + 0.3V)
DBP, ABP to GND .......................................-0.3V to minimum of
(4V and (V CC + 0.3V))
Continuous Current (all pins) .......................................... Q 20mA
Continuous Power Dissipation (T A = +70 N C)
28-Pin TQFN (derate 34.5mW/ N C above +70 N C) ..... 2759mW*
Thermal Resistance (Note 1)
B JA ................................................................................29 N C/W
B JC ........................ …………………………….………… 2 N C/W
Operating Temperature Range .......................... -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
*As per JEDEC 51 Standard, Multilayer Board (PCB).
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V CC = 2.8V to 14V, T A = T J = -40 N C to +85 N C, unless otherwise specified. Typical values are at V ABP = V DBP = V CC = 3.3V,
T A = +25 N C.) (Note 2)
PARAMETER
Operating Voltage Range
Undervoltage Lockout
SYMBOL
V CC
V UVLO
CONDITIONS
RESET output asserted low
Minimum voltage on V CC to ensure the
device is flash configurable
MIN
1.2
2.8
TYP
MAX
14
2.7
UNITS
V
V
Undervoltage Lockout Hysteresis
UVLO HYS
55
mV
Minimum Flash Operating Voltage
V FLASH
I CC1
Minimum voltage on V CC to ensure flash
erase and write operations
No load on any output
2.7
2.8
4
V
Supply Current
I CC2
No load on any output, during flash writing
cycle
7.7
14
mA
V CC = V ABP = V DBP = 3.6V (Note 3)
5
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
V DBP
V ABP
t BOOT
V CC = 5V, C DBP = 1 F F, no loa d
V CC = 5V, C ABP = 1 F F, no loa d
V CC > V UVLO
2.8
2.85
3
3
100
3.2
3.15
200
V
V
F s
Flash Writing Time
8-byte word
122
ms
Internal Timing Accuracy
(Note 4)
-10
+10
%
ADC
Resolution
10
Bits
Gain Error
Offset Error
ADC GAIN
ADC OFF
T A = +25 N C
T A = -40 N C to +85 N C
0.35
0.75
1.5
%
LSB
2
______________________________________________________________________________________
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