参数资料
型号: MC33910G5AC
厂商: Freescale Semiconductor
文件页数: 60/90页
文件大小: 0K
描述: IC SYSTEM BASIS CHIP 32LQFP
标准包装: 250
应用: 系统基础芯片
电流 - 电源: 4.5mA
电源电压: 5.5 V ~ 27 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 32-LQFP
供应商设备封装: 32-LQFP(7x7)
包装: 托盘
MC33910BAC / MC34910BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 34. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ V SUP ≤ 18 V, -40°C ≤ T A ≤ 125°C for the 33910 and -40°C ≤ T A ≤ 85°C for the
34910, unless otherwise noted. Typical values noted reflect the approximate parameter mean at T A = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
L1 INPUT
Wake-up Filter Time
t WUF
8.0
20
38
μ s
STATE MACHINE TIMING
Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command)
and Stop Mode Activation (107)
Normal Request Mode Timeout (see Figure 33 )
t STOP
t NR TOUT
110
150
5.0
205
μ s
ms
Delay Between SPI Command and HS Turn On (108)
t S- ON
μ s
9.0 V < V SUP < 27 V
Delay Between SPI Command and HS Turn Off (108)
9.0 V < V SUP < 27 V
t S- OFF
10
10
μ s
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request mode) (107)
t SNR2N
10
μ s
Delay Between CS Wake-up ( CS LOW to HIGH) in Stop Mode and:
μ s
Normal Request mode, VDD ON and RST HIGH
First Accepted SPI Command
t WUCS
t WUSPI
9.0
90
15
80
N/A
Minimum Time Between Rising and Falling Edge on the CS
t 2CS
4.0
μ s
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC (109) , (110)
Duty Cycle 1: D1 = t BUS_REC(MIN) /(2 x t BIT ), t BIT = 50 μs
7.0 V ≤ V SUP ≤ 18 V
Duty Cycle 2: D2 = t BUS_REC(MAX) /(2 x t BIT ), t BIT = 50 μs
7.6 V ≤ V SUP ≤ 18 V
D1
D2
0.396
0.581
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4
KBIT/SEC (109) , (111)
Duty Cycle 3: D3 = t BUS_REC(MIN) /(2 x t BIT ), t BIT = 96 μs
7.0 V ≤ V SUP ≤ 18 V
Duty Cycle 4: D4 = t BUS_REC(MAX) /(2 x t BIT ), t BIT = 96 μs
7.6 V ≤ V SUP ≤ 18 V
D3
D4
0.417
0.590
μ s
μ s
Notes
107. This parameter is guaranteed by process monitoring but, not production tested.
108. Delay between turn on or off command (rising edge on CS) and HS ON or OFF, excluding rise or fall time due to external load.
109. Bus load R BUS and C BUS 1.0 nF / 1.0 k Ω , 6.8 nF / 660 Ω , 10 nF / 500 Ω . Measurement thresholds: 50% of TXD signal to LIN signal
threshold defined at each parameter. See Figure 27 .
110. See Figure 28 .
111. See Figure 29 .
33910
Analog Integrated Circuit Device Data
Freescale Semiconductor
60
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