参数资料
| 型号： | MC34703PNB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/46页 |
| 文件大小： | 0K |
| 描述： | IC POWER SUPPLY QUICC 33-QFN |
| 标准包装： | 1 |
| 应用： | 电源 |
| 电流 - 电源： | 60mA |
| 电源电压： | 2.8 V ~ 13.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 33-PowerQFN |
| 供应商设备封装： | 33-PQFN（10x10） |
| 包装： | 管件 |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Switching Node
Buck Regulator Bootstrap Input (BOOT - SW)
Differential Voltage (SR - SW)
V IN1 , V IN2
SW
BOOT
V SR
-0.3 to 14
-1.0 to 14
-0.3 to 8.5
-0.3 to 8.5
V
V
V
V
Boost Regulator Output
(1)
V BST
-0.3 to 8.5
V
Boost Regulator Drain
RESET Drain Voltage
Enable Pins (EN1, EN2)
Logic Pins (SDA, SCL, CLKSYN)
Analog Pins (INV, V OUT )
Analog Pins (LDRV , LFB, LDO, LCMP, ISNS)
Analog Pins (CLKSEL, ADDR, RT, FREQ, V DDI )
ESD Voltage
Human Body Model (2)
Machine Model (3)
V BD
RESET
V ENABLE
V LOGIC
V ANALOG1
V ANALOG2
V ANALOG3
V ESD1
V ESD2
-0.3 to 9.5
-0.3 to 7.0
-0.3 to 14
-0.3 to 7.0
-0.3 to 7.0
-0.3 to 8.5
-0.3 to 3.6
±2000
±200
V
V
V
V
V
V
V
V
THERMAL RATINGS
Storage Temperature
Power Dissipation (T A = 85°C) (4)
Lead Soldering Temperature (5)
Maximum Operating Junction Temperature
Package Operating Temperature Range (Ambient Temperature)
T STG
P D
T SOLDER
T JMAX
T A
-65 to 150
2.0
245
125
-40 to 85
° C
W
° C
° C
°C
THERMAL RESISTANCE
Thermal Resistance, Junction to Ambient (6)
R θ JA
38
° C/W
Thermal Resistance, Junction to Base
(7)
R θ JB
~1.0
° C/W
Notes
1. Maximum recommended filter capacitor: 10 μ F. (Note, VBST pin is not short-circuit protected.)
2. ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 ? ).
3.
4.
5.
6.
7.
ESD2 testing is performed in accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 ? ).
Maximum still-air power dissipation at indicated ambient temperature; higher power dissipations may be possible with additional heat-
sinking and forced-air cooling.
Lead soldering temperature limit is for 10 seconds maximum duration. Contact Freescale Sales Office for immersion soldering time/
temperature limits.
Thermal resistance measured in accordance with EIA/JESD51-2.
Theoretical thermal resistance from the die junction to the exposed heat-sinking pins.
34703
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
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