- 您现在的位置：买卖IC网 > PDF目录67997 > MPC5606SCMG6 (FREESCALE SEMICONDUCTOR INC) 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PBGA208 PDF资料下载
参数资料
| 型号： | MPC5606SCMG6 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PBGA208 |
| 封装： | 17 X 17 MM, 1 MM PITCH, MAPBGA-208 |
| 文件页数： | 94/134页 |
| 文件大小： | 890K |
| 代理商： | MPC5606SCMG6 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页当前第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页
MPC560xS Microcontroller Data Sheet, Rev. 5
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
62
PD
= power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm
2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using Equation 2:
TJ = TB + (RJB PD)
Eqn. 2
where:
TB
= board temperature for the package perimeter (°C)
RJB = junction-to-board thermal resistance (°C/W) per JESD51-8S
PD
= power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RJA = RJC + RCA
Eqn. 3
where:
RJA = junction to ambient thermal resistance (°C/W)
RJC = junction to case thermal resistance (°C/W)
RCA = case to ambient thermal resistance (°C/W)
RJC s device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat
sink to ambient. For most packages, a better model is required.
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5606S
products
in
208
MAPBGA
packages
相关PDF资料 |
PDF描述 |
|---|---|
| MPC602AFUXXEX | RISC PROCESSOR, PQFP144 |
| MPC602AFUXXCX | RISC PROCESSOR, PQFP144 |
| MPC603PRX166LX | 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255 |
| MPC603PRX180LX | 32-BIT, 180 MHz, RISC PROCESSOR, CBGA255 |
| MPC603PFE166LX | 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5606S-DEMO-V2 | 功能描述:开发板和工具包 - 其他处理器 EVB MPC5606S RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC5607B | 制造商:Freescale Semiconductor 功能描述: |
| MPC5607B_13 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MicrocontrollerData Sheet |
| MPC5607BECLLR | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5607BECLQR | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
发布紧急采购，3分钟左右您将得到回复。