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参数资料
| 型号： | MPC5606SCMG6 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PBGA208 |
| 封装： | 17 X 17 MM, 1 MM PITCH, MAPBGA-208 |
| 文件页数： | 96/134页 |
| 文件大小： | 890K |
| 代理商： | MPC5606SCMG6 |
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MPC560xS Microcontroller Data Sheet, Rev. 5
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
64
3.6.2
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified
MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in
particular.
Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC
level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
— Corrupted program counter
— Unexpected reset
— Critical data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the
software can be hardened to prevent unrecoverable errors occurring.
3.6.3
Electromagnetic interference (EMI)
3.6.4
Absolute maximum ratings (electrical sensitivity)
Based on two different tests (ESD and LU) using specific measurement methods, the product is stressed in order to determine
its performance in terms of electrical sensitivity.
3.6.4.1
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according
to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This
test conforms to the AEC-Q100-002/-003/-011 standard.
Table 18. EMI testing specifications1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03.
Symbol
C
Parameter
Conditions
Value
Unit
Min
Typ Max
—
SR T Scan range
150 kHz – 30 MHz: RBW 9 kHz, step size 5 kHz
30 MHz – 1 GHz: RBW 120 kHz, step size 80 kHz
0.15
—
1000 MHz
—
SR T Operating frequency Crystal frequency 8 MHz
—
64
—
MHz
—
SR T VDD12, VDDPLL
operating voltages
——
1.2
—
V
—
SR T VDD, VDDA
operating voltages
——
5
—
V
—
SR T Maximum amplitude
No PLL frequency modulation
—
33
—
dBV
±2% PLL frequency modulation
—
30
—
SR T Operating
temperature
——
25
—
°C
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC5606S
products
in
208
MAPBGA
packages
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