参数资料
型号: NTD5413NT4G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 60V 30A DPAK
产品变化通告: Reactivation Notice 28/Jun/2011
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 30A
开态Rds(最大)@ Id, Vgs @ 25° C: 26 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 46nC @ 10V
输入电容 (Ciss) @ Vds: 1725pF @ 25V
功率 - 最大: 68W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
NTD5413N
Power MOSFET
30 Amps, 60 Volts Single N ? Channel
DPAK
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? These are Pb ? Free Devices
Applications
? LED Lighting and LED Backlight Drivers
? DC ? DC Converters
? DC Motor Drivers
? Switch Mode Power Supplies
? Power Supplies Secondary Side Synchronous Rectification
V (BR)DSS
60 V
http://onsemi.com
R DS(ON) MAX
26 m W @ 10 V
N ? Channel
D
I D MAX
(Note 1)
30 A
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Symbol
V DSS
V GS
Value
60
$ 20
Unit
V
V
G
S
Gate ? to ? Source Voltage ? Nonrepetitive
(T P < 10 m s)
Continuous Drain Steady T C = 25 ° C
Current R q JC State
(Note 1) T C = 100 ° C
Power Dissipation Steady T C = 25 ° C
R q JC (Note 1) State
V GS
I D
P D
$ 30
30
23
68
V
A
W
4
DPAK
MARKING
DIAGRAM
4
Drain
1
Gate
Pulsed Drain Current t p = 10 m s
Operating and Storage Temperature Range
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 V dc , V GS = 10 V, I L(pk) = 30 A,
L = 0.3 mH, R G = 25 W )
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
I DM
T J , T stg
I S
E AS
T L
84
? 55 to
+175
30
135
260
A
° C
A
mJ
° C
1 2
3
CASE 369AA
STYLE 2
5413N = Device Code
Y = Year
WW = Work Week
G = Pb ? Free Device
2
Drain
3
Source
THERMAL RESISTANCE RATINGS
Parameter
Junction ? to ? Case (Drain) Steady State
(Note 1)
Symbol
R q JC
R q JA
Max
2.2
58.5
Unit
° C/W
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
? Semiconductor Components Industries, LLC, 2008
October, 2008 ? Rev. 0
1
Publication Order Number:
NTD5413N/D
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