参数资料
型号: NTGD3148NT1G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH DUAL 20V 3.5A 6TSOP
标准包装: 1
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 70 毫欧 @ 3.5A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 3.8nC @ 4.5V
输入电容 (Ciss) @ Vds: 300pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: SC-74,SOT-457
供应商设备封装: 6-TSOP
包装: 标准包装
其它名称: NTGD3148NT1GOSDKR
NTGD3148N
Power MOSFET
20 V, 3.5 A, Dual N-Channel, TSOP-6
Features
? Low Threshold Levels, VGS(th) < 1.5 V
? Low Gate Charge (3.8 nC)
? Leading Edge Trench Technology of Low R DS(on)
? High Power and Current Handling Capability
? This is a Pb-Free Device
Applications
? DC-DC Converters (Buck and Boost Circuits)
? Low Side Load Switch
? Optimized for Battery and Load Management Applications in
Portable Equipment Like Cell Phones, DSCs, Media Player, Etc
?
Battery Charging and Protection Circuits
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
20 V
http://onsemi.com
N-CHANNEL MOSFET
R DS(on) Max
70 m W @ 4.5 V
100 m W @ 2.5 V
D
G
I D Max
3.5 A
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Symbol
V DSS
V GS
Value
20
± 12
Unit
V
V
S
N-CHANNEL MOSFET
Continuous Drain
Current (Note 1)
Continuous Drain
Steady State
t ≤ 5 s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
I D
3.0
2.2
3.5
A
A
MARKING
DIAGRAM
Current (Note 1)
Power Dissipation
(Note 1)
Steady State
t ≤ 5 s
T A = 25 ° C
P D
0.9
1.1
W
1
TSOP-6
CASE 318G
DN M G
G
Pulsed Drain Current
t p = 10 m s
I DM
10
A
STYLE 13
1
Operating Junction and Storage Temperature
T J , T STG
-50 to
150
° C
DN = Specific Device Code
M = Date Code
Source Current (Body Diode)
I S
0.8
A
G
= Pb-Free Package
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE RATINGS
T L
260
° C
(Note: Microdot may be in either location)
PIN CONNECTION
Parameter
Junction-to-Ambient – Steady State (Note 1)
Junction-to-Ambient – t ≤ 5 s (Note 1)
Symbol
R q JA
R q JA
Value
140
110
Unit
° C/W
° C/W
D 2
S 1
4
5
3 G 2
2 S 2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
D 1
6
1 G 1
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 0
1
Publication Order Number:
NTGD3148N/D
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