参数资料
型号: NTGD3149CT1G
厂商: ON Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET COMPL 20V DUAL 6-TSOP
产品变化通告: Product Obsolescence 08/Apr/2011
标准包装: 3,000
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 3.2A,2.4A
开态Rds(最大)@ Id, Vgs @ 25° C: 60 毫欧 @ 3.5A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 5.5nC @ 4.5V
输入电容 (Ciss) @ Vds: 387pF @ 10V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: SC-74,SOT-457
供应商设备封装: 6-TSOP
包装: 带卷 (TR)
NTGD3149C
Power MOSFET
Complementary, 20 V, +3.5/ ? 2.7 A,
TSOP ? 6 Dual
60 m W @ 4.5 V
Features
? Complementary N ? Channel and P ? Channel MOSFET
? Small Size (3 x 3 mm) Dual TSOP ? 6 Package
? Leading Edge Trench Technology for Low On Resistance
? Reduced Gate Charge to Improve Switching Response
? Independently Connected Devices to Provide Design Flexibility
? This is a Pb ? Free Device
Applications
? DC ? DC Conversion Circuits
? Load/Power Switching with Level Shift
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
N ? Ch
20 V
P ? Ch
? 20 V
D1
http://onsemi.com
R DS(on) MAX I D MAX (Note 1)
3.5 A
90 m W @ 2.5 V
110 m W @ 4.5 V
? 2.7 A
145 m W @ 2.5 V
S2
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
(N ? Ch & P ? Ch)
V DSS
V GS
20
± 8
V
V
G1
G2
N ? Channel
Continuous Drain
Current (Note 1)
P ? Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain
Current
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
Steady State
t ≤ 5s
N ? Ch
P ? Ch
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
t p = 10 m s
I D
I D
P D
I DM
3.2
2.3
3.5
2.4
1.7
2.7
0.9
1.1
11
8.0
A
A
W
A
S1
N ? CHANNEL MOSFET
1
TSOP ? 6
CASE 318G
STYLE 13
D2
P ? CHANNEL MOSFET
MARKING
DIAGRAM
CC M G
G
1
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T STG
I S
T L
? 55 to
150
0.8
260
° C
A
° C
CC = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN CONNECTION
THERMAL RESISTANCE RATINGS
Parameter
Junction ? to ? Ambient – Steady State (Note 1)
Junction ? to ? Ambient – t ≤ 5 s (Note 1)
Symbol
R q JA
R q JA
Value
140
110
Unit
° C/W
° C/W
G1
S2
1
2
6 D1
5 S1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
G2
3
(Top View)
4 D2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
? Semiconductor Components Industries, LLC, 2008
May, 2008 ? Rev. 0
1
Publication Order Number:
NTGD3149C/D
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