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参数资料
型号： ORT82G5-2F680I
厂商： Lattice Semiconductor Corporation
文件页数： 20/119页
文件大小： 0K
描述： IC FPSC TRANSCEIVER 8CH 680-BGA
产品变化通告： Product Discontinuation 01/Aug/2011
标准包装： 24
系列： *
Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
116
Table 46. Heat Sink Vendors
Package Parasitics
The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the
package parasitics. Table 47 lists eight parasitics associated with the ORCA packages. These parasitics represent
the contributions of all components of a package, which include the bond wires, all internal package routing, and
the external leads.
Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and
inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near-
est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed
to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading
effect of the lead. Resistance values are in mΩ.
The parasitic values in Table 47 are for the circuit model of bond wire and package lead parasitics. If the mutual
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be
added to each of the C1 and C2 capacitors.
Table 47. ORCA Typical Package Parasitics
Figure 41. Package Parasitics
Package Outline Drawings
Package Outline Drawings for the 484-ball PBGAM (fpBGA) used for the ORT42G5 and 680-ball PBGAM (fpBGA)
used for the ORT82G5 are available in the Package Diagrams section of the Lattice Semiconductor web site at
www.latticesemi.com.
Vendor
Location
Phone
Aavid Thermalloy
Concord, NH
(603) 224-9988
Chip Coolers
Warwick, RI
(800) 227-0254
IERC
Burbank, CA
(818) 842-7277
R-Theta
Buffalo, NY
(800) 388-5428
Sanyo Denki
Torrance, CA
(310) 783-5400
Wakeeld Thermal Solutions
Pelham, NH
(800) 325-1426
LSW
LMW
RW
C1
C2
CM
LSL
LML
3.8
1.3
250
1.0
0.3
2.8-5
0.5 -1
PAD N
Board Pads
CM
C1
LSW
RW
LSL
LMW
C2
C1
LML
C2
PAD N + 1
LSW
RW
LSL
Circuit
Pad N+1
Pad N
Package
Pads
相关PDF资料
PDF描述
ORT82G5-2F680C IC FPSC TRANSCEIVER 8CH 680-BGA
D38999/26JC8PN CONN PLUG 8POS STRAIGHT W/PINS
MS27467T25F61SC CONN PLUG 61POS STRAIGHT W/SCKT
31-320-RFX BNC PLUG, CRIMP RG-58
D38999/24JD19PN CONN RCPT 19POS JAM NUT W/PINS
相关代理商/技术参数
参数描述
ORT82G5-2FN680C 功能描述:FPGA - 现场可编程门阵列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
ORT82G5-2FN680C1 功能描述:FPGA - 现场可编程门阵列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
ORT82G5-2FN680I 功能描述:FPGA - 现场可编程门阵列 ORCA FPSC 3.7 Gb Bp ln Xcvr 643K Gt I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
ORT82G5-2FN680I1 功能描述:FPGA - 现场可编程门阵列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
ORT82G5-3BM680C 功能描述:FPGA - 现场可编程门阵列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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