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参数资料
| 型号： | PowerPC 740 |
| 厂商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) |
| 中文描述： | 32位嵌入式微处理器（32位精简指令集嵌入式微处理器） |
| 文件页数： | 10/48页 |
| 文件大小： | 608K |
| 代理商： | POWERPC 740 |
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Page 10
Version 1.02
12/8/99
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the PowerPC
740 and PowerPC 750 User’s Manualfor more information on the use of this feature. Specifications for the
thermal sensor portion of the TAU are found in the table below.
.
L2 bus supply voltage, pin A19 tied to GND
L2OV
DD(1.8V)
1.71 to 1.89
V
1
Input voltage (Under AC conditions, inputs must go rail-to-
rail for maximum AC timing performance.)
V
IN(60X)
GND to OV
DD
V
1
V
IN(L2)
GND to L2OV
DD
V
1
Die-junction temperature
T
J
-40 to 105
°
C
1, 2
Package Thermal Characteristics
1
Characteristic
Symbol
740
750
Unit
Thermal resistance, junction-to-case (top sur-
face of die) typical
θ
JC
0.03
0.03
°
C/W
Thermal resistance, junction-to-balls, typical
θ
JB
3.8 - 7.1
2
3.8 - 7.6
2
°
C/W
Thermal resistance, junction-to-ambient, at air-
flow, no heat sink, typical
50 FPM
16.0
15.1
°
C/W
100 FPM
15.4
16.4
°
C/W
150 FPM
14.9
14.2
°
C/W
200 FPM
14.4
13.7
°
C/W
Package Size
21 x 21
25 x 25
mm
2
Die Size
5.12 x 7.78
5.12 x 7.78
mm
2
Note:
1. Refer to Section “Thermal Management Information,” on page 40 for more information about thermal management.
2. 3.8
°
C/W is theoretical
θ
mounted to infinite heat sink. The larger number applies to module mounted to a 1.8 mm thick, 2P card using 1 oz. copper
power/gnd planes, with effective area for heat transfer of 75mm x 75mm.
Thermal Sensor Specifications
See Table “Recommended Operating Conditions,” on page 9, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
Notes
1
Temperature range
0
128
°
C
1
2
Comparator settling time
20
—
ms
2
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact
ppcsupp@us.ibm.com. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR. For parts with
nominal operating frequencies (speed sort) above 266 MHz, the settling time = 20
μ
s
×
(266/nominal frequency). For example: for 500 MHz parts,
settling time = 20
μ
s
×
(266/500) = 10.6
μ
s. It is recommended that the maximum value be set in THRM3 under all conditions.
3. This value is guaranteed by design and is not tested.
Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Note:
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.
V
DD
and
T
J
are specified by the Application Conditions designator in the part number. See the Part Number Key on Page 43 for more information.
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