参数资料
型号: PowerPC 740
厂商: IBM Microeletronics
英文描述: 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器)
中文描述: 32位嵌入式微处理器(32位精简指令集嵌入式微处理器)
文件页数: 30/48页
文件大小: 608K
代理商: POWERPC 740
Page 30
Version 1.02
12/8/99
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 750 ceramic ball grid array 360 CBGA
packages.
Figure 15 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 15. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17 18 19
U
V
W
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