参数资料
型号: PowerPC 740
厂商: IBM Microeletronics
英文描述: 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器)
中文描述: 32位嵌入式微处理器(32位精简指令集嵌入式微处理器)
文件页数: 43/48页
文件大小: 608K
代理商: POWERPC 740
12/8/99
Version 1.02
Page43
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors.
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
517-496-4000
Figure 22. Thermal Performance of Select Thermal Interface Material
S
2
/
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
+
+
+
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
+
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