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| 型号： | PowerPC 740 |
| 厂商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) |
| 中文描述： | 32位嵌入式微处理器（32位精简指令集嵌入式微处理器） |
| 文件页数： | 41/48页 |
| 文件大小： | 608K |
| 代理商： | POWERPC 740 |
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12/8/99
Version 1.02
Page41
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
The board designer can choose between several types of heat sinks to place on the 750. There are several
commercially-available heat sinks for the 750 provided by the following vendors:
Chip Coolers, Inc.
333 Strawberry Field Rd.
Warwick, RI 02887-6979
800-227-0254 (USA/Canada)
401-739-7600
Thermalloy
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
214-243-4321
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
818-842-7277
Aavid Engineering
One Kool Path
Laconic, NH 03247-0440
603-528-3400
Wakefield Engineering
60 Audubon Rd.
Wakefield, MA 01880
617-245-5900
Ultimately, the final selection of an appropriate heat sink for the 750 depends on many factors, such as ther-
mal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table “Package Thermal Characteristics1,” on page 10,
the intrinsic conduction thermal resistance paths are as follows.
Die junction-to-case thermal resistance
Die junction-to-ball thermal resistance
Figure 21 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
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