- 您现在的位置：买卖IC网 > PDF目录370013 > PowerPC 740 (IBM Microeletronics) 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) PDF资料下载
参数资料
| 型号： | PowerPC 740 |
| 厂商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) |
| 中文描述： | 32位嵌入式微处理器（32位精简指令集嵌入式微处理器） |
| 文件页数： | 44/48页 |
| 文件大小： | 608K |
| 代理商： | POWERPC 740 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页当前第44页第45页第46页第47页第48页
Page 44
Version 1.02
12/8/99
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
617-935-4850
Thermagon, Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
216-741-7659
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
860-571-5100
AI Technology (e.g. EG7655)
1425 Lower Ferry Road
Trent, NJ 08618
609-882-2332
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.
T
J
= T
A
+ T
R
+ (
θ
JC
+
θ
INT
+
θ
SA
)
×
P
D
Where
:
T
J
is the die-junction temperature
T
A
is the inlet cabinet ambient temperature
T
R
is the air temperature rise within the system cabinet
θ
JC
is the junction-to-case thermal resistance
θ
INT
is the thermal resistance of the thermal interface material
θ
SA
is the heat sink-to-ambient thermal resistance
P
D
is the power dissipated by the device
Typical die-junction temperatures (T
) should be maintained less than the value specified in Table “Package
Thermal Characteristics1,” on page 10. The temperature of the air cooling the component greatly depends
upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic
cabinet inlet-air temperature (T
A
) may range from 30 to 40
°
C. The air temperature rise within a cabinet (T
R
)
may be in the range of 5 to 10
°
C. The thermal resistance of the interface material (
θ
) is typically about 1
°
C/
W. Assuming a T
of 30
°
C, a T
of 5
°
C, a CBGA package
θ
JC
= 0.03, and a power dissipation (P
D
) of 5.0 watts,
the following expression for T
J
is obtained.
Die-junction temperature: T
J
= 30
°
C + 5
°
C + (0.03
°
C/W +1.0
°
C/W +
θ
SA
)
×
5W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA
) versus air flow velocity
is shown in Figure 23.
相关PDF资料 |
PDF描述 |
|---|---|
| PowerPC 750CX | 32-Bit Reduced Instruction Set Computer (RISC) Microprocessors(32位精简指令集微处理器) |
| PowerPC 750 | 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) |
| PP-MOD1V2 | ISP INTERFACE MODULE |
| PP01002 | GEHOERSCHUTZ OHRSTOEPSEL 250ST Inhalt pro Packung: 250 Stk. |
| PP0901SA | Direct ProTek Replacement:PP0901SA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| POWERPLUG15W | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:AC/DC POWER SUPPLY |
| POWERPLUG24W | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:AC/DC POWER SUPPLY |
| POWERPLUS 2C 2500MAH | 制造商:Energizer Battery Company 功能描述: |
| POWERPLUS 2D 2500MAH | 制造商:Energizer Battery Company 功能描述: |
| POWERPLUS 4AAA 850MAH | 制造商:Energizer Battery Company 功能描述: |
发布紧急采购，3分钟左右您将得到回复。