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| 型号： | PowerPC 740 |
| 厂商： | IBM Microeletronics |
| 英文描述： | 32-Bit Embedded Microprocessor(32位精简指令集嵌入式微处理器) |
| 中文描述： | 32位嵌入式微处理器（32位精简指令集嵌入式微处理器） |
| 文件页数： | 11/48页 |
| 文件大小： | 608K |
| 代理商： | POWERPC 740 |
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12/8/99
Version 1.02
Page11
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
μ
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
3
Resolution
4
—
°
C
3
4
Drift, all sources
—
.25
LSb
5
Linearity, error over range
—
1
LSb
6
Offset error, reducible
—
2
LSb
DC Electrical Specifications
See Section “Recommended Operating Conditions,” on page 9, for operating conditions.
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
V
IH(3.3V)
2.0
3.465
V
1,2
V
IH(2.5V)
1.75
2.625
V
IH()1.8V
1.4
1.89
Input low voltage (all inputs except SYSCLK)
V
IL(3.3V)
GND
0.8
V
V
IL(2.5V)
GND
0.7
V
IL()1.8V
GND
0.5
SYSCLK input high voltage
CV
IH(3.3V)
2.0
3.465
V
1, 4
CV
IH(2.5V)
2.0
2.625
CV
IH(1.8V)
1.5
1.89
SYSCLK input low voltage
CV
IL
–
0.4
V
4
Input leakage current, V
IN
= OV
DD
I
IN
–
20
μ
A
1,2
Hi-Z (off state) leakage current, Vin = OV
DD
I
TSI
–
20
μ
A
1,2
Output high voltage, I
OH
= –6mA
V
OH(3.3V)
2.4
–
V
Output high voltage, I
OH
= –6mA
V
OH((2.5V))
1.9
–
V
Output high voltage, I
OH
= –3mA
V
OH(1.8V)
1.4
–
V
Output low voltage, I
OL
= 6mA
V
OL
–
0.4
V
Capacitance, V
IN
=0 V, f = 1MHz
C
IN
–
5.0
pF
2,3
Note:
1. For 60x bus signals, the reference is OV
DD
, while L2OV
DD
is the reference for the L2 bus signals.
2. JTAG port signal levels are controlled by the BVSEL pin and are the same as those shown for the 60x bus. LSSD_MODE, L1_TSTCLK, and L2TSTCLK
receiver voltage levels are those shown for OVdd = 1.8V nominal, regardless of BVSEL. JTAG, LSSD_MODE, L1_TSTCLK, and L2TSTCLK values in
this table are guaranteed by design and characterization, and are not tested.
3. Capacitance values are guaranteed by design and characterization, and are not tested.
4. SYSCLK input high and low voltage: I/O timings are measured using a “rail to rail” SYSCLK; I/O timing may be less favorable if SYSCLK does not travel
from GND to OV
DD.
Thermal Sensor Specifications
See Table “Recommended Operating Conditions,” on page 9, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
Notes
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact
ppcsupp@us.ibm.com. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR. For parts with
nominal operating frequencies (speed sort) above 266 MHz, the settling time = 20
μ
s
×
(266/nominal frequency). For example: for 500 MHz parts,
settling time = 20
μ
s
×
(266/500) = 10.6
μ
s. It is recommended that the maximum value be set in THRM3 under all conditions.
3. This value is guaranteed by design and is not tested.
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