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参数资料
| 型号： | S29AL032D70BAE002 |
| 厂商： | Spansion Inc. |
| 英文描述： | 32 Megabit CMOS 3.0 Volt-only Flash Memory |
| 中文描述： | 32兆位的CMOS 3.0伏只闪存 |
| 文件页数： | 4/69页 |
| 文件大小： | 1970K |
| 代理商： | S29AL032D70BAE002 |
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S29AL032D
S29AL032D_00_A3 June 13, 2005
Advan ce
In form ati o n
Ordering Information
S29AL032D Standard Products
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
Notes:
1. Type 0 is standard. Specify other options as required.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your
local sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29AL032D
70
T
A
I
00
0
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
00
= x8, VCC = 2.7 V to 3.6 V, Uniform sector device
03
= x8/x16, VCC = 2.7 V to 3.6 V, Top boot sector device, top two address
sectors protected when WP#/ACC = VIL
04
= x8/x16, VCC = 2.7 V to 3.6 V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC = VIL
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
E
= Engineering Samples (available prior to Production Release only)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
SPEED OPTION
See “Product Selector Guide” and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29AL032D
3.0 Volt-only, 32 Megabit Standard Flash Memory
manufactured using 200 nm process technology
S29AL032D Valid Combinations
Package Description
Device Number
Speed
Option
Package Type,
Material, and
Temperature Range
Model
Number
Packing Type
S29AL032D
70, 90
TAI, TFI
00
0, 3 (Note 1)
TS040 (Note 2)
TSOP
03, 04
TS048 (Note 2)
TSOP
BAI, BFI
00, 03, 04
0, 2, 3 (Note 1)
VBN048 (Note 3)
Fine-Pitch BGA
相关PDF资料 |
PDF描述 |
|---|---|
| S29AL032D90TFI042 | 32 Megabit CMOS 3.0 Volt-only Flash Memory |
| S29AL032D90TFI043 | 32 Megabit CMOS 3.0 Volt-only Flash Memory |
| S29CD016G0JDEI004 | 512K X 32 FLASH 2.7V PROM, 67 ns, UUC76 |
| S29CD016G0JDEI007 | 512K X 32 FLASH 2.7V PROM, 67 ns, UUC76 |
| S29CD032J1JFAI122 | 1M X 32 FLASH 2.7V PROM, 54 ns, PBGA80 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29AL032D70BAI000 | 制造商:Spansion 功能描述:NOR Flash Parallel 3.3V 32Mbit 4M x 8bit 70ns 48-Pin FBGA Tray |
| S29AL032D70BAI030 | 制造商:Spansion 功能描述:NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin FBGA Tray |
| S29AL032D70BAI032 | 制造商:Spansion 功能描述:NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin FBGA T/R |
| S29AL032D70BFI000 | 功能描述:闪存 32MB 闪存 3V 70ns Parallel NOR 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| S29AL032D70BFI030 | 功能描述:闪存 32MB 闪存 3V 70ns Parallel NOR 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
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