参数资料
型号: S29GL032N90BFI32
厂商: SPANSION LLC
元件分类: PROM
英文描述: 2M X 16 FLASH 3V PROM, 90 ns, PBGA48
封装: 8.15 X 6.15 MM, LEAD FREE, FBGA-48
文件页数: 8/81页
文件大小: 3095K
代理商: S29GL032N90BFI32
16
S29GL-N MirrorBit Flash Family
S29GL-N_01_12 October 29, 2008
Da ta
Sh e e t
7.
Ordering Information–S29GL064N
S29GL064N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
7.1
Valid Combinations
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
S29GL064N
90
T
F
I
02
2
PACKING TYPE
0
=
Tray
2
=
7-inch Tape and Reel
3
=
13-inch Tape and Reel
MODEL NUMBER
01 =
x8/x16, VCC = VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed sector
02 =
x8/x16, VCC = VIO = 2.7 – 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector
03 =
x8/x16, VCC = 2.7 – 3.6 V, Top boot sector, WP#/ACC = VIL protects top two addressed sectors
04 =
x8/x16, VCC = 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = VIL protects bottom two addressed sectors
06 =
x16, VCC = 2.7 – 3.6 V, Uniform sector, WP# = VIL protects highest addressed sector
07 =
x16, VCC = 2.7 – 3.6 V, Uniform sector, WP# = VIL protects lowest addressed sector
V1 =
x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects highest addressed sector
V2 =
x8/x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP#/ACC = VIL protects lowest addressed sector
V6 =
x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP# = VIL protects highest addressed sector
V7 =
x16, VCC = 2.7 – 3.6 V, VIO = 1.65 - 3.6 V, Uniform sector, WP# = VIL protects lowest addressed sector
TEMPERATURE RANGE
I
=
Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A
=
Standard (Note 4)
F
=
Pb-Free
PACKAGE TYPE
B
=
Fine-pitch Ball-Grid Array Package
D
=
Fortified Ball-Grid Array Package(LAE064), 9 mm x 9 mm
F
=
Fortified Ball-Grid Array Package (LAA064), 13 mm x 11 mm
T
=
Thin Small Outline Package (TSOP) Standard Pinout
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
DEVICE NUMBER/DESCRIPTION
S29GL064N, 64 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit Process Technology, 3.0 Volt-only Read, Program, and Erase
S29GL064N Valid Combinations
Package Description
Device Number
Speed
Option
Package, Material, &
Temperature Range
Model Number
Packing Type
S29GL064N
90
TFI
03, 04, 06, 07
0,2,3 (Note 1)
TS048 (Note 2)
TSOP
11
V6, V7
90
01, 02
TS056 (Note 2)
11
V1, V2
90
BFI
03, 04
VBK048 (Note 3)
Fine-Pitch BGA
90
FFI
01, 02, 03, 04
LAA064 (Note 3)
Fortified BGA
11
V1, V2
90
DFI
01, 02, 03, 04
LAE064 (Note 3)
11
V1, V2
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