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| 型号： | SC16C2552BIA44,512 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 27/37页 |
| 文件大小： | 0K |
| 描述： | IC UART DUAL SOT187-2 |
| 标准包装： | 26 |
| 特点： | 2 通道 |
| 通道数： | 2，DUART |
| FIFO's： | 16 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 44-LCC（J 形引线） |
| 供应商设备封装： | 44-PLCC |
| 包装： | 管件 |
| 其它名称： | 935274408512 SC16C2552BIA44 SC16C2552BIA44-ND |
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SC16C2552B_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 12 February 2009
33 of 38
NXP Semiconductors
SC16C2552B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
12.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 16) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 26 and 27
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 16.
Table 26.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 27.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C2552BIA44-T | 功能描述:UART 接口集成电路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C2552CIA44,512 | 制造商:NXP Semiconductors 功能描述: 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/TUBEDP// - Rail/Tube |
| SC16C2552CIA44,518 | 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/REEL13DP// - Tape and Reel |
| SC16C2552CIA44,529 | 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/TUBESMDP// - Rail/Tube |
| SC16C2552IA44 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs |
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