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参数资料
| 型号： | SSTUG32868ET/G |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 锁存器 |
| 英文描述： | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA176 |
| 封装： | 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176 |
| 文件页数： | 12/29页 |
| 文件大小： | 166K |
| 代理商： | SSTUG32868ET/G |
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SSTUG32868_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 23 April 2007
2 of 29
NXP Semiconductors
SSTUG32868
1.8 V DDR2-1G congurable registered buffer with parity
I Two additional chip select inputs allow optional exible enabling and disabling
I Supports Stub Series Terminated Logic SSTL_18 data inputs
I Differential clock (CK and CK) inputs
I Supports Low Voltage Complementary Metal Oxide Semiconductor (LVCMOS)
switching levels on the control and RESET inputs
I Single 1.8 V supply operation (1.7 V to 2.0 V)
I Available in 176-ball 6 mm × 15 mm, 0.65 mm ball pitch TFBGA package
3.
Applications
I 400 MT/s to 800 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
I DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
4.
Ordering information
4.1 Ordering options
Table 1.
Ordering information
Type number
Solder process
Package
Name
Description
Version
SSTUG32868ET/G
Pb-free (SnAgCu solder ball
compound)
TFBGA176 plastic thin ne-pitch ball grid array package;
176 balls; body 6
× 15 × 0.7 mm
SOT932-1
SSTUG32868ET/S
Pb-free (SnAgCu solder ball
compound)
TFBGA176 plastic thin ne-pitch ball grid array package;
176 balls; body 6
× 15 × 0.7 mm
SOT932-1
Table 2.
Ordering options
Type number
Temperature range
SSTUG32868ET/G
Tamb = 0 °C to +70 °C
SSTUG32868ET/S
Tamb = 0 °C to +85 °C
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| SSTUP32866EC/S | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| SSTV16857EC | POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA56 |
| SSTV16859DGG,118 | SSTV SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO64 |
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| SSTV16859EC,518 | SSTV SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PBGA96 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SSTUG32868ETS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUG32868G | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUH32864 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications |
| SSTUH32864EC | 功能描述:寄存器 1.8V CONFIG REG BUFFER/DDRII RoHS:否 制造商:NXP Semiconductors 逻辑类型:CMOS 逻辑系列:HC 电路数量:1 最大时钟频率:36 MHz 传播延迟时间: 高电平输出电流:- 7.8 mA 低电平输出电流:7.8 mA 电源电压-最大:6 V 最大工作温度:+ 125 C 封装 / 箱体:SOT-38 封装:Tube |
| SSTUH32864EC,518 | 功能描述:寄存器 1.8V CONFIG REG RoHS:否 制造商:NXP Semiconductors 逻辑类型:CMOS 逻辑系列:HC 电路数量:1 最大时钟频率:36 MHz 传播延迟时间: 高电平输出电流:- 7.8 mA 低电平输出电流:7.8 mA 电源电压-最大:6 V 最大工作温度:+ 125 C 封装 / 箱体:SOT-38 封装:Tube |
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