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参数资料
| 型号： | SSTUG32868ET/G |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 锁存器 |
| 英文描述： | 32868 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA176 |
| 封装： | 6 X 15 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, MO-246, SOT932-1, TFBGA-176 |
| 文件页数： | 18/29页 |
| 文件大小： | 166K |
| 代理商： | SSTUG32868ET/G |
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SSTUG32868_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 23 April 2007
25 of 29
NXP Semiconductors
SSTUG32868
1.8 V DDR2-1G congurable registered buffer with parity
13. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SSTUG32868ETS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUG32868G | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications |
| SSTUH32864 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications |
| SSTUH32864EC | 功能描述:寄存器 1.8V CONFIG REG BUFFER/DDRII RoHS:否 制造商:NXP Semiconductors 逻辑类型:CMOS 逻辑系列:HC 电路数量:1 最大时钟频率:36 MHz 传播延迟时间: 高电平输出电流:- 7.8 mA 低电平输出电流:7.8 mA 电源电压-最大:6 V 最大工作温度:+ 125 C 封装 / 箱体:SOT-38 封装:Tube |
| SSTUH32864EC,518 | 功能描述:寄存器 1.8V CONFIG REG RoHS:否 制造商:NXP Semiconductors 逻辑类型:CMOS 逻辑系列:HC 电路数量:1 最大时钟频率:36 MHz 传播延迟时间: 高电平输出电流:- 7.8 mA 低电平输出电流:7.8 mA 电源电压-最大:6 V 最大工作温度:+ 125 C 封装 / 箱体:SOT-38 封装:Tube |
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