参数资料
型号: ST10F269DIETR
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, UUC
封装: DIE
文件页数: 16/161页
文件大小: 1595K
代理商: ST10F269DIETR
ST10F269-T3
112/160
The R0-C0 components on RPD pin are mainly implemented to provide a time delay to exit Power down
mode (see Chapter 19 - Power Reduction Modes). Nevertheless, they drive RPD pin level during resets
and they lead to different reset modes as explained hereafter. On power-on, C0 is totally discharged, a
low level on RPD pin forces an asynchronous hardware reset. C0 capacitor starts to charge through R0
and at the end of reset sequence ST10F269-T3 restarts. RPD pin threshold is typically 2.5V.
Depending on the delay of the next applied reset, the MCU can enter a synchronous reset or an
asynchronous reset. If RPD pin is below 2.5V an asynchronous reset starts, if RPD pin is above 2.5V a
synchronous reset starts. (See Section 18.1 - Long Hardware Reset and Section 18.2 - Short Hardware
Reset).
Note that an internal pull-down is connected to RPD pin and can drive a 100
A to 200A current. This
Pull-down is turned on when RSTIN pin is low.
To properly use the bidirectional reset features, the schematic (or equivalent) of Figure 60 must be
implemented. R1-C1 only work for power-on or manual reset in the same way as explained previously. D1
diode brings a faster discharge of C1 capacitor at power-off during repetitive switch-on / switch-off
sequences. D2 diode performs an OR-wired connection, it can be replaced with an open drain buffer. R2
resistor may be added to increase the pull-up current to the open drain in order to get a faster rise time on
RSTIN pin when bidirectional function is activated.
The start-up configurations and some system features are selected on reset sequences as described in
Table 29 and Table 30.
Table 29 describes what is the system configuration latched on PORT0 in the five different reset ways.
Table 30 summarizes the state of bits of PORT0 latched in RP0H, SYSCON, BUSCON0 registers.
Figure 58 : Internal (simplified) Reset Circuitry.
RSTOUT
EINIT Instruction
Trigger
Clr
Clock
Reset State
Machine
Internal
Reset
Signal
Reset Sequence
(512 CPU Clock Cycles)
SRST instruction
watchdog overflow
RSTIN
VDD
BDRSTEN
VDD
RPD
Weak pull-down
(~200
A)
From/to Exit
Powerdown
Circuit
Asynchronous
Reset
Clr
Q
Set
相关PDF资料
PDF描述
ST10F269Z2Q3 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP144
ST10F269Z2Q6 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP144
ST10F276Z5Q3 16-BIT, MROM, 64 MHz, RISC MICROCONTROLLER, PQFP144
ST10F296TR 16-BIT, FLASH, 64 MHz, MICROCONTROLLER, PBGA208
ST10R172LT6 16-BIT, 50 MHz, MICROCONTROLLER, PQFP100
相关代理商/技术参数
参数描述
ST10F269-DP 功能描述:16位微控制器 - MCU 16-bit MCU MAC 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269-DPB 功能描述:16位微控制器 - MCU 16-bit MCU MAC 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269-DPR 功能描述:16位微控制器 - MCU 16Bit MCU 256K BYTE FLASH,12K BYTE RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269DT3 功能描述:16位微控制器 - MCU 16Bit MCU 256K BYTE FLASH,12K BYTE RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
ST10F269DTR3 功能描述:16位微控制器 - MCU 16-bit MCU MAC unit 256 Kbyte Flash RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT