- 您现在的位置：买卖IC网 > PDF目录17057 > TRK-MPC5634M (Freescale Semiconductor)TRAK 5634M 144PN R2.1 PDF资料下载
参数资料
| 型号： | TRK-MPC5634M |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 81/122页 |
| 文件大小： | 0K |
| 描述： | TRAK 5634M 144PN R2.1 |
| 设计资源： | TRK-MPC5634M Schematic |
| 标准包装： | 1 |
| 系列： | MPC56xx |
| 类型： | MCU |
| 适用于相关产品： | MPC5634M |
| 所含物品： | 板，线缆，CD，DVD |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页当前第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页
Electrical characteristics
MPC5634M Microcontroller Data Sheet, Rev. 9
Freescale Semiconductor
61
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RJA = RJC + RCA
Eqn. 3
where:
RJA = junction-to-ambient thermal resistance (oC/W)
RJC = junction-to-case thermal resistance (oC/W)
RCA = case to ambient thermal resistance (oC/W)
RJC is device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat
sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the
junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the
thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple
estimations and for computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization
parameter (
JT) to determine the junction temperature by measuring the temperature at the top center of the package case using
the following equation:
TJ = TT + (JT x PD)
Eqn. 4
where:
TT = thermocouple temperature on top of the package (oC)
JT = thermal characterization parameter (oC/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests
on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from
the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling
effects of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic
Packaging and Production, pp. 53-58, March 1998.
相关PDF资料 |
PDF描述 |
|---|---|
| REF191GSZ | IC VREF SERIES PREC 2.048V 8SOIC |
| DEMO56F8014-EE | BOARD DEMO FOR 56F8014 |
| 0210490222 | CABLE JUMPER 1.25MM .152M 16POS |
| EVAL-AD7795EBZ | BOARD EVAL FOR AD7795 |
| VI-B1V-EY | CONVERTER MOD DC/DC 5.8V 50W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TRK-USB-MPC5602P | 功能描述:开发板和工具包 - 其他处理器 STRAKMiniUSB RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TRK-USB-MPC5604B | 功能描述:开发板和工具包 - 其他处理器 MiniUSB MPC5604B RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TRK-USB-MPC5643L | 功能描述:开发板和工具包 - 其他处理器 StarTrakMiniUSG MPC5643L RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TRK-USB-S12G128 | 功能描述:开发板和工具包 - 其他处理器 S12G128 STRAKMiniUSB RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TRL00317 | 制造商:Syracuse 功能描述: |
发布紧急采购，3分钟左右您将得到回复。