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| 型号： | TWR-MPC8309 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 75/81页 |
| 文件大小： | 0K |
| 描述： | TOWER SYSTEM MODULE MPC8309 |
| 设计资源： | TWR-MPC8309 Schematic |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | Freescale 电源塔系统 |
| 所含物品： | 板，线缆 |
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System design information
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
24.2.1
Experimental determination of the junction temperature with a heat
sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface.
From this case temperature, the junction temperature is determined from the junction-to-case thermal
resistance using the following equation:
T J = T C + ( R θ JC × P D )
Eqn. 5
where:
T C = case temperature of the package ( ° C)
R θ JC = junction-to-case thermal resistance ( ° C/W)
P D = power dissipation (W)
25 System design information
This section provides electrical and thermal design recommendations for successful application of the
MPC8309.
25.1
System clocking
The MPC8309 includes three PLLs.
? The system PLL (AV DD2 ) generates the system clock from the externally supplied SYS_CLK_IN
input. The frequency ratio between the system and SYS_CLK_IN is selected using the system PLL
ratio configuration bits as described in Section 23.4, “System PLL configuration.”
? The e300 core PLL (AV DD3 ) generates the core clock as a slave to the system clock. The frequency
ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio
configuration bits as described in Section 23.5, “Core PLL configuration.”
? The QUICC Engine PLL (AV DD1 ) which uses the same reference as the system PLL. The QUICC
Engine block generates or uses external sources for all required serial interface clocks.
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
75
相关PDF资料 |
PDF描述 |
|---|---|
| TWR-PXN20-KIT | TOWER SYSTEM KIT PXN20 |
| TWR-PXS2010-KIT | TOWER SYSTEM KIT PXS2010 |
| TWR-PXS3020-KIT | TOWER SYSTEM KIT PXS3020 |
| TWR-S08DC-PT60 | TOWER SYSTEM BOARD S08PT60 |
| TWR-S08JE128-KIT | KIT TOWER FOR MC9S08JE |
相关代理商/技术参数 |
参数描述 |
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| TWR-P1025 | 功能描述:开发板和工具包 - 其他处理器 TOWER MODULE P1025 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TWR-P1025-KIT | 功能描述:开发板和工具包 - 其他处理器 QORIQ P1 TWR KIT RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| TWRPI-BLE-DEMO | 功能描述:蓝牙/802.15.1 开发工具 TWRPI-BLE-DEMO RoHS:否 制造商:Panasonic Electronic Components 产品:Bluetooth Evaluation Kit 工具用于评估:PAN1721 频率:2.4 GHz 接口类型:I2C 工作电源电压:2 V to 3.6 V |
| TWRPI-MMA6900 | 功能描述:加速传感器开发工具 MMA6900 SENSOR PLUG-IN RoHS:否 制造商:Murata 工具用于评估:SCA3100-D04 加速:2 g 传感轴:Triple Axis 接口类型:SPI 工作电压:3.3 V |
| TWRPI-MMA845XQ | 功能描述:加速传感器开发工具 Accel TWRPI RoHS:否 制造商:Murata 工具用于评估:SCA3100-D04 加速:2 g 传感轴:Triple Axis 接口类型:SPI 工作电压:3.3 V |
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