参数资料
型号: TWR-MPC8309
厂商: Freescale Semiconductor
文件页数: 9/81页
文件大小: 0K
描述: TOWER SYSTEM MODULE MPC8309
设计资源: TWR-MPC8309 Schematic
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MPU
适用于相关产品: Freescale 电源塔系统
所含物品: 板,线缆
Electrical characteristics
2.1.2
Power supply voltage specification
The following table provides the recommended operating conditions for the MPC8309. Note that these
values are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
Table 2. Recommended operating conditions
Core supply voltage
PLL supply voltage
Characteristic
Symbol
V DD
AV DD1
Recommended
Value
1.0 V ± 50 mV
1.0 V ± 50 mV
Unit
V
V
Note
1
1
AV DD2
AV DD3
DDR2 DRAM I/O voltage
PCI, Local bus, DUART, system control and power management,
I 2 C, SPI, MII, RMII, MII management, eSDHC, FlexCAN,USB and
GV DD
OV DD
1.8 V ± 100 mV
3.3 V ± 300 mV
V
V
1
1, 3
JTAG I/O voltage
Junction temperature
T A /T J
0 to 105
° C
2
Notes:
1. GV DD , OV DD , AV DD , and V DD must track each other and must vary in the same direction—either in the positive or negative
direction.
2. Minimum temperature is specified with T A (Ambient Temperature); maximum temperature is specified with T J (Junction
Temperature).
3. OVDD here refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map.
The following figure shows the undershoot and overshoot voltages at the interfaces of the MPC8309
G/OV DD + 20%
G/OV DD + 5%
V IH
G/OV DD
GND
GND – 0.3 V
V IL
Note:
GND – 0.7 V
Not to Exceed 10%
of t interface1
1. t interface refers to the clock period associated with the bus clock interface.
Figure 2. Overshoot/Undershoot voltage for GV DD /OV DD
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
9
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