参数资料
型号: W25Q128BVFIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 128M X 1 SPI BUS SERIAL EEPROM, PDSO16
封装: 0.300 INCH, GREEN, SOIC-16
文件页数: 56/74页
文件大小: 855K
代理商: W25Q128BVFIG
W25Q128BV
- 6 -
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and a 24-ball 8x6-mm TFBGA (package code C) as shown in Figure 1a-c respectively. Package
diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
1
2
3
4
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOL
DI (IO
CLK
Top View
D (IO
3)
0)
8
7
6
5
Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2 Pad Description WSON 8x6-mm
PAD NO.
PAD NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)*
1
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)*
2
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)*
1
6
CLK
I
Serial Clock Input
7
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*
2
8
VCC
Power Supply
*1: IO0 and IO1 are used for Standard and Dual SPI instructions
*2: IO0 – IO3 are used for Quad SPI instructions
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