参数资料
| 型号： | W25Q16BVSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/68页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 16MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 16M（2M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q16BV
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES....................................................................................................................................... 5
PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6
PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6
PAD CONFIGURATION PDIP 300-MIL ........................................................................................... 7
PIN DESCRIPTION SOIC 150/208-MIL, PDIP 300-MIL AND WSON 6X5-MM............................... 7
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8
8.1
8.2
8.3
8.4
8.5
8.6
Package Types..................................................................................................................... 9
Chip Select (/CS).................................................................................................................. 9
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9
Write Protect (/WP)............................................................................................................... 9
HOLD (/HOLD) ..................................................................................................................... 9
Serial Clock (CLK) ................................................................................................................ 9
9.
10.
BLOCK DIAGRAM.......................................................................................................................... 10
FUNCTIONAL DESCRIPTION ....................................................................................................... 11
10.1
SPI OPERATIONS ............................................................................................................. 11
10.1.1
10.1.2
10.1.3
10.1.4
Standard SPI Instructions...................................................................................................11
Dual SPI Instructions ..........................................................................................................11
Quad SPI Instructions.........................................................................................................11
Hold Function .....................................................................................................................11
10.2
WRITE PROTECTION ....................................................................................................... 12
10.2.1
Write Protect Features........................................................................................................12
11.
CONTROL AND STATUS REGISTERS ........................................................................................ 13
11.1
STATUS REGISTER .......................................................................................................... 13
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
11.1.9
BUSY..................................................................................................................................13
Write Enable Latch (WEL) ..................................................................................................13
Block Protect Bits (BP2, BP1, BP0)....................................................................................13
Top/Bottom Block Protect (TB)...........................................................................................13
Sector/Block Protect (SEC) ................................................................................................13
Status Register Protect (SRP1, SRP0)...............................................................................14
Erase Suspend Status (SUS) .............................................................................................14
Quad Enable (QE) ..............................................................................................................14
Status Register Memory Protection ....................................................................................16
11.2
INSTRUCTIONS................................................................................................................. 17
11.2.1
Manufacturer and Device Identification ..............................................................................17
-2-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q16BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM 制造商:Winbond 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM |
| W25Q16BVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16BVZPIG | 功能描述:IC SPI FLASH 16MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q16BVZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CL | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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