参数资料
| 型号： | W25Q16BVSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/68页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 16MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 16M（2M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q16BV
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Instruction Set Table 1 (Erase, Program Instructions) ........................................................18
Instruction Set Table 2 (Read Instructions) ........................................................................19
Instruction Set Table 3 (ID, Security Instructions)...............................................................20
Write Enable (06h)..............................................................................................................21
Write Disable (04h).............................................................................................................21
Read Status Register-1 (05h) and Read Status Register-2 (35h).......................................22
Write Status Register (01h) ................................................................................................23
Read Data (03h) .................................................................................................................24
Fast Read (0Bh) ...............................................................................................................25
Fast Read Dual Output (3Bh) ...........................................................................................26
Fast Read Quad Output (6Bh)..........................................................................................27
Fast Read Dual I/O (BBh).................................................................................................28
Fast Read Quad I/O (EBh) ...............................................................................................30
Word Read Quad I/O (E7h) ..............................................................................................32
Octal Word Read Quad I/O (E3h).....................................................................................34
Page Program (02h) .........................................................................................................36
Quad Input Page Program (32h) ......................................................................................37
Sector Erase (20h) ...........................................................................................................38
32KB Block Erase (52h) ...................................................................................................39
64KB Block Erase (D8h)...................................................................................................40
Chip Erase (C7h / 60h).....................................................................................................41
Erase Suspend (75h)........................................................................................................42
Erase Resume (7Ah) ........................................................................................................43
Power-down (B9h) ............................................................................................................44
Release Power-down / Device ID (ABh) ...........................................................................45
Read Manufacturer / Device ID (90h) ...............................................................................47
Read Manufacturer / Device ID Dual I/O (92h) .................................................................48
Read Manufacturer / Device ID Quad I/O (94h)................................................................49
Read Unique ID Number (4Bh).........................................................................................50
Read JEDEC ID (9Fh) ......................................................................................................51
Continuous Read Mode Reset (FFh or FFFFh) ................................................................52
12.
ELECTRICAL CHARACTERISTICS .............................................................................................. 53
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Absolute Maximum Ratings................................................................................................ 53
Operating Ranges .............................................................................................................. 53
Power-up Timing and Write Inhibit Threshold .................................................................... 54
DC Electrical Characteristics.............................................................................................. 55
AC Measurement Conditions ............................................................................................. 56
AC Electrical Characteristics .............................................................................................. 57
AC Electrical Characteristics (cont’d)................................................................................. 58
Publication Release Date: July 08, 2010
-3-
Revision F
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q16BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM 制造商:Winbond 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM |
| W25Q16BVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16BVZPIG | 功能描述:IC SPI FLASH 16MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q16BVZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CL | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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