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参数资料
| 型号： | W3E32M72S-266BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| 封装： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 19/19页 |
| 文件大小： | 739K |
| 代理商： | W3E32M72S-266BC |
W3E32M72S-XBX
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
March 2006
Rev. 2
White Electronic Designs Corp. reserves the right to change products or specications without notice.
TRUTH TABLE – COMMANDS (NOTE 1)
NOTES:
1.
CKE is HIGH for all commands shown except SELF REFRESH.
2.
A0-12 dene the op-code to be written to the selected Mode Register. BA0, BA1
select either the mode register (0, 0) or the extended mode register (1, 0).
3.
A0-12 provide row address, and BA0, BA1 provide bank address.
4.
A0-9 provide column address; A10 HIGH enables the auto precharge feature (non
persistent), while A10 LOW disables the auto precharge feature; BA0, BA1 provide
bank address.
5.
A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks
precharged and BA0, BA1 are “Don’t Care.”
NAME (FUNCTION)
CS#
RAS#
CAS#
WE#
ADDR
DESELECT (NOP) (9)
H
X
NO OPERATION (NOP) (9)
L
H
X
ACTIVE (Select bank and activate row) ( 3)
L
H
Bank/Row
READ (Select bank and column, and start READ burst) (4)
L
H
L
H
Bank/Col
WRITE (Select bank and column, and start WRITE burst) (4)
L
H
L
Bank/Col
BURST TERMINATE (8)
L
H
L
X
PRECHARGE (Deactivate row in bank or banks) ( 5)
L
H
L
Code
AUTO REFRESH or SELF REFRESH (Enterselfrefreshmode) (6, 7)
L
H
X
LOAD MODE REGISTER (2)
L
Op-Code
TRUTH TABLE – DM OPERATION
NAME (FUNCTION)
DM
DQs
WRITE ENABLE (10)
L
Valid
WRITE INHIBIT (10)
H
X
6.
This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is
LOW.
7.
Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t
Care” except for CKE.
8.
Applies only to read bursts with auto precharge disabled; this command is
undened (and should not be used) for READ bursts with auto precharge enabled
and for WRITE bursts.
9.
DESELECT and NOP are functionally interchangeable.
10. Used to mask write data; provided coincident with the corresponding data.
during an AUTO REFRESH command. Each DDR SDRAM
requires AUTO REFRESH cycles at an average interval
of 7.8125μs (maximum).
To allow for improved efficiency in scheduling and
switching between tasks, some exibility in the absolute
refresh interval is provided. A maximum of eight AUTO
REFRESH commands can be posted to any given DDR
SDRAM, meaning that the maximum absolute interval
between any AUTO REFRESH command and the next
AUTO REFRESH command is 9 x 7.8125μs (70.3μs). This
maximum absolute interval is to allow future support for
DLL updates internal to the DDR SDRAM to be restricted
to AUTO REFRESH cycles, without allowing excessive
drift in tAC between updates.
Although not a JEDEC requirement, to provide for future
functionality features, CKE must be active (High) during
the AUTO REFRESH period. The AUTO REFRESH period
begins when the AUTO REFRESH command is registered
and ends tRFC later.
SELF REFRESH*
The SELF REFRESH command can be used to retain
data in the DDR SDRAM, even if the rest of the system is
powered down. When in the self refresh mode, the DDR
SDRAM retains data without external clocking. The SELF
REFRESH command is initiated like an AUTO REFRESH
command except CKE is disabled (LOW). The DLL is
automatically disabled upon entering SELF REFRESH and
is automatically enabled upon exiting SELF REFRESH (A
DLL reset and 200 clock cycles must then occur before a
READ command can be issued). Input signals except CKE
are “Don’t Care” during SELF REFRESH. VREF voltage is
also required for the full duration of SELF REFRESH.
The procedure for exiting self refresh requires a sequence
of commands. First, CK and CK# must be stable prior
to CKE going back HIGH. Once CKE is HIGH, the DDR
SDRAM must have NOP commands issued for tXSNR,
because time is required for the completion of any internal
refresh in progress.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M72S-266BI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M72S-266BM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M72S-266SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M72S-266SBI | 制造商:White Electronic Designs 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 208 PBGA, IND TEMP CUSTOM - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3E32M72S-266SBM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32Mx72 DDR SDRAM |
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