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参数资料
| 型号： | W3E32M72S-266BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| 封装： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 9/19页 |
| 文件大小： | 739K |
| 代理商： | W3E32M72S-266BC |
W3E32M72S-XBX
17
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
March 2006
Rev. 2
White Electronic Designs Corp. reserves the right to change products or specications without notice.
All linear dimensions are millimeters and parenthetically in inches
Bottom View
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
32.1 (1.264) MAX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
25.1
(0.988)
MAX
0.61
(0.024)
NOM
2.03 (0.080)
MAX
19.05 (0.750) NOM
1.27
(0.050)
NOM
19.05
(0.750)
NOM
219 X 0.762 (0.030) NOM
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M72S-266BI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M72S-266BM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M72S-266SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M72S-266SBI | 制造商:White Electronic Designs 功能描述:32M X 72 DDR, 2.5V, 266 MHZ, 208 PBGA, IND TEMP CUSTOM - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3E32M72S-266SBM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32Mx72 DDR SDRAM |
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