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参数资料
| 型号： | W9425G6EB-6I |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | DRAM |
| 英文描述： | 16M X 16 DDR DRAM, 0.7 ns, PBGA60 |
| 封装： | 8 X 13 MM, ROHS COMPLIANT, TFBGA-60 |
| 文件页数： | 19/51页 |
| 文件大小： | 2017K |
| 代理商： | W9425G6EB-6I |
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W9425G6EB
Publication Release Date:Feb. 12, 2009
- 26 -
Revision A02
9.5 DC Characteristics
MAX.
SYM.
PARAMETER
-5
-6I
UNIT NOTES
IDD0
Operating current: One Bank Active-Precharge;
tRC = tRC min; tCK = tCK min;
DQ, DM and DQS inputs changing once per clock cycle;
Address and control inputs changing once every two clock cycles
110
7
IDD1
Operating current: One Bank Active-Read-Precharge;
Burst = 4; tRC = tRC min; CL = 3; tCK = tCK min; IOUT = 0 mA;
Address and control inputs changing once per clock cycle
150
7, 9
IDD2P
Precharge Power Down standby current:
All Banks Idle; Power down mode;
CKE < VIL max; tCK = tCK min; Vin = VREF for DQ, DQS and DM
20
IDD2F
Idle floating standby current:
CS > VIH min; All Banks Idle; CKE > VIH min; tCK = tCK min;
Address and other control inputs changing once per clock cycle;
Vin = VREF for DQ, DQS and DM
45
7
IDD2N
Idle standby current:
CS
> VIH min; All Banks Idle; CKE > VIH min; tCK = tCK min;
Address and other control inputs changing once per clock cycle;
Vin > VIH min or Vin < VIL max for DQ, DQS and DM
45
7
IDD2Q
Idle quiet standby current:
CS > VIH min; All Banks Idle; CKE > VIH min; tCK = tCK min;
Address and other control inputs stable;
Vin > VREF for DQ, DQS and DM
40
7
IDD3P
Active Power Down standby current:
One Bank Active; Power down mode;
CKE < VIL max; tCK = tCK min;
Vin = VREF for DQ, DQS and DM
20
IDD3N
Active standby current:
CS > VIH min; CKE > VIH min; One Bank Active-Precharge;
tRC = tRAS max; tCK = tCK min;
DQ, DM and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once per clock cycle
70
7
IDD4R
Operating current:
Burst = 2; Reads; Continuous burst; One Bank Active;
Address and control inputs changing once per clock cycle;
CL=2; tCK = tCK min; IOUT = 0mA
180
170
7, 9
IDD4W
Operating current:
Burst = 2; Write; Continuous burst; One Bank Active;
Address and control inputs changing once per clock cycle;
CL = 2; tCK = tCK min;
DQ, DM and DQS inputs changing twice per clock cycle
180
170
7
IDD5
Auto Refresh current: tRC = tRFC min
190
7
IDD6
Self Refresh current: CKE < 0.2V; external clock on; tCK = tCK min
3
IDD7
Random Read current: 4 Banks Active Read with activate every 20nS,
Auto-Precharge Read every 20 nS;
Burst = 4; tRCD = 3; IOUT = 0mA;
DQ, DM and DQS inputs changing twice per clock cycle;
Address changing once per clock cycle
300
mA
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W9425G6EH | 制造商:WINBOND 制造商全称:Winbond 功能描述:4 M 】 4 BANKS 】 16 BITS DDR SDRAM |
| W9425G6EH_0812 | 制造商:WINBOND 制造商全称:Winbond 功能描述:4 M × 4 BANKS × 16 BITS DDR SDRAM |
| W9425G6EH-5 | 功能描述:IC DDR-400 SDRAM 256MB 66TSSOPII RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W9425G6EH-5I | 制造商:Winbond Electronics Corp 功能描述: |
| W9425G6JB-5 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin TFBGA 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY 制造商:Winbond 功能描述:16MX16,256Mb DDRI DRAM ,200MHZ, BGA |
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