参数资料
型号: W989D2CBJX6E
厂商: WINBOND ELECTRONICS CORP
元件分类: DRAM
英文描述: 16M X 32 DDR DRAM, 5.4 ns, PBGA90
封装: 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90
文件页数: 60/67页
文件大小: 1469K
代理商: W989D2CBJX6E
W989D6CB / W989D2CB
512Mb Mobile LPSDR
Publication Release Date: Jun, 27, 2011
- 63 -
Revision A01-004
11. PACKAGE DIMENSION
11.1 : LPSDR X 16
VFBGA54Ball (8X9 MM^2, Ball pitch:0.8mm)
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow.The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad
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相关代理商/技术参数
参数描述
W989D2CBJX6I 制造商:WINBOND 制造商全称:Winbond 功能描述:512Mb Mobile LPSDR
W989D2CBJX7E 制造商:Winbond Electronics Corp 功能描述:DRAM Chip Mobile LPSDR SDRAM 512M-Bit 16Mx32 1.8V 90-Pin VFBGA
W989D2CBJX7G 制造商:WINBOND 制造商全称:Winbond 功能描述:512Mb Mobile LPSDR
W989D2KBJX6E 制造商:Winbond Electronics Corp 功能描述:IC LPSDR SDRAM 512MBIT 90VFBGA
W989D2KBJX6I 制造商:Winbond Electronics Corp 功能描述:IC LPSDR SDRAM 512MBIT 90VFBGA