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参数资料
| 型号： | WEDPND16M72S-266BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 16M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| 封装： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 7/16页 |
| 文件大小： | 441K |
| 代理商： | WEDPND16M72S-266BC |
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPND16M72S-XBX
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
BOTTOM VIEW
32.32 (1.272) MAX
1 2 345 6789 10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
25.25 (0.994)
MAX
0.60 (0.024)
± 0.10 (0.004)
2.20 (0.087)
MAX
19.05 (0.750) NOM
1.27/2
1.27 (0.050)
BSC
19.05 (0.750)
NOM
219 X
0.835
PACKAGE DIMENSION: 219 PLASITC BALL GRID ARRAY (PBGA)
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
DDR SDRAM
CONFIGURATION, 16M x 72
2.5V Power Supply
FREQUENCY (MHz)
200 = 200MHz
250 = 250MHz
266 = 266MHz
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I
= Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
WED P ND 16M 72 S - XXX B X
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相关代理商/技术参数 |
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| WEDPNF8M721V-1010BC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M721V-1010BI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M721V-1010BM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M721V-1012BC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
| WEDPNF8M721V-1012BI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package |
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