参数资料
型号: XC2S100-5FGG256C
厂商: Xilinx Inc
文件页数: 91/99页
文件大小: 0K
描述: IC SPARTAN-II FPGA 100K 256-FBGA
标准包装: 90
系列: Spartan®-II
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 176
门数: 100000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
其它名称: 122-1302
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
91
R
I/O
1
P174
B10
C14
72
I/O
1
-
B14
75
I/O
1
P175
D10
D13
81
I/O
1
P176
A10
C13
84
GND
-
P177
GND*
-
VCCO
1-
VCCO
Bank 1*
VCCO
Bank 1*
-
I/O, VREF
1
P178
B9
B13
87
I/O
1
P179
E10
E12
90
I/O
1
-
A9
B12
93
I/O
1
P180
D9
D12
96
I/O
1
-
C12
99
I/O
1
P181
A8
D11
102
I, GCK2
1
P182
C9
A11
108
GND
-
P183
GND*
-
VCCO
1
P184
VCCO
Bank 1*
VCCO
Bank 1*
-
VCCO
0
P184
VCCO
Bank 0*
VCCO
Bank 0*
-
I, GCK3
0
P185
B8
C11
109
VCCINT
-
P186
VCCINT*VCCINT*-
I/O
0
-
E11
116
I/O
0
P187
A7
A10
119
I/O
0
-
D8
B10
122
I/O
0
P188
A6
C10
125
I/O, VREF
0
P189
B7
A9
128
VCCO
0-
VCCO
Bank 0*
VCCO
Bank 0*
-
GND
-
P190
GND*
-
I/O
0
P191
C8
B9
131
I/O
0
P192
D7
E10
134
I/O
0
-
D10
140
I/O
0
P193
E7
A8
143
I/O
0
-
D9
146
I/O
0
-
B8
149
I/O
0
P194
C7
E9
155
I/O
0
P195
B6
A7
158
XC2S150 Device Pinouts (Continued)
XC2S150 Pad Name
PQ208
FG256
FG456
Bndry
Scan
Function
Bank
VCCINT
-
P196
VCCINT*VCCINT*-
VCCO
0
P197
VCCO
Bank 0*
VCCO
Bank 0*
-
GND
-
P198
GND*
-
I/O
0
P199
A5
B7
161
I/O, VREF
0
P200
C6
E8
164
I/O
0
-
D8
167
I/O
0
P201
B5
C7
170
I/O
0
-
D6
D7
173
I/O
0
-
B6
176
I/O
0
-
A5
179
I/O
0
P202
A4
D6
182
I/O, VREF
0
P203
B4
C6
185
VCCO
0-
VCCO
Bank 0*
VCCO
Bank 0*
-
GND
-
GND*
-
I/O
0
P204
E6
B5
188
I/O
0
-
D5
E7
191
I/O
0
-
A4
194
I/O
0
-
E6
197
I/O
0
P205
A3
B4
200
GND
-
GND*
-
I/O
0
-
C5
A3
203
I/O
0
-
B3
206
I/O
0
-
D5
209
I/O
0
P206
B3
C5
212
TCK
-
P207
C4
-
VCCO
0
P208
VCCO
Bank 0*
VCCO
Bank 0*
-
VCCO
7
P208
VCCO
Bank 7*
VCCO
Bank 7*
-
04/18/01
Notes:
1.
IRDY and TRDY can only be accessed when using Xilinx PCI
cores.
2.
Pads labelled GND*, VCCINT*, VCCO Bank 0*, VCCO Bank 1*,
VCCO Bank 2*, VCCO Bank 3*, VCCO Bank 4*, VCCO Bank 5*,
VCCO Bank 6*, VCCO Bank 7* are internally bonded to
independent ground or power planes within the package.
3.
See "VCCO Banks" for details on VCCO banking.
XC2S150 Device Pinouts (Continued)
XC2S150 Pad Name
PQ208
FG256
FG456
Bndry
Scan
Function
Bank
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