参数资料
型号: XC2S100-5FGG256C
厂商: Xilinx Inc
文件页数: 98/99页
文件大小: 0K
描述: IC SPARTAN-II FPGA 100K 256-FBGA
标准包装: 90
系列: Spartan®-II
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 176
门数: 100000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
其它名称: 122-1302
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
98
R
GND
-
P198
GND*
-
I/O
0
P199
A5
B7
188
I/O, VREF
0
P200
C6
E8
191
I/O
0
-
D8
197
I/O
0
P201
B5
C7
200
GND
-
GND*
-
I/O
0
-
D6
D7
203
I/O
0
-
B6
206
I/O
0
-
A5
209
I/O
0
P202
A4
D6
212
I/O, VREF
0
P203
B4
C6
215
VCCO
0-
VCCO
Bank 0*
VCCO
Bank 0*
-
GND
-
GND*
-
I/O
0
P204
E6
B5
218
I/O
0
-
D5
E7
221
I/O
0
-
A4
224
I/O
0
-
E6
230
I/O, VREF
0
P205
A3
B4
233
GND
-
GND*
-
I/O
0
-
C5
A3
236
I/O
0
-
B3
239
I/O
0
-
D5
242
I/O
0
P206
B3
C5
248
TCK
-
P207
C4
-
VCCO
0
P208
VCCO
Bank 0*
VCCO
Bank 0*
-
VCCO
7
P208
VCCO
Bank 7*
VCCO
Bank 7*
-
04/18/01
Notes:
1.
IRDY and TRDY can only be accessed when using Xilinx PCI
cores.
2.
Pads labelled GND*, VCCINT*, VCCO Bank 0*, VCCO Bank 1*,
VCCO Bank 2*, VCCO Bank 3*, VCCO Bank 4*, VCCO Bank 5*,
VCCO Bank 6*, VCCO Bank 7* are internally bonded to
independent ground or power planes within the package.
3.
See "VCCO Banks" for details on VCCO banking.
XC2S200 Device Pinouts (Continued)
XC2S200 Pad Name
PQ208
FG256
FG456
Bndry
Scan
Function
Bank
Additional XC2S200 Package Pins
PQ208
Not Connected Pins
P55
P56
--
11/02/00
FG256
VCCINT Pins
C3
C14
D4
D13
E5
E12
M5
M12
N4
N13
P3
P14
VCCO Bank 0 Pins
E8
F8
--
VCCO Bank 1 Pins
E9
F9
--
VCCO Bank 2 Pins
H11
H12
--
VCCO Bank 3 Pins
J11
J12
--
VCCO Bank 4 Pins
L9
M9
--
VCCO Bank 5 Pins
L8
M8
--
VCCO Bank 6 Pins
J5
J6
--
VCCO Bank 7 Pins
H5
H6
-
GND Pins
A1
A16
B2
B15
F6
F7
F10
F11
G6
G7
G8
G9
G10
G11
H7
H8
H9
H10
J7
J8
J9
J10
K6
K7
K8
K9
K10
K11
L6
L7
L10
L11
R2
R15
T1
T16
Not Connected Pins
P4
R4
--
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