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参数资料
| 型号： | AD6623PCB |
| 厂商： | Analog Devices, Inc. |
| 英文描述： | 4-Channel, 104 MSPS Digital Transmit Signal Processor TSP |
| 中文描述： | 4通道，104 MSPS的数字传输信号处理器判刑 |
| 文件页数： | 4/40页 |
| 文件大小： | 381K |
| 代理商： | AD6623PCB |
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REV. 0
–4–
AD6623
RECOMMENDED OPERATING CONDITIONS
Test
Level
AD6623
Typ
Parameter
Min
Max
Unit
VDD
VDDIO
T
AMBIENT
IV
IV
IV
2.25
3.0
–40
2.5
3.3
+25
2.75
3.6
+70
V
V
°
C
ELECTRICAL CHARACTERISTICS
Parameter (Conditions)
Temp
Test Level
Min
Typ
Max
Unit
LOGIC INPUTS (5 V TOLERANT)
Logic Compatibility
Logic “1” Voltage
Logic “0” Voltage
Logic “1” Current
Logic “0” Current
Input Capacitance
Full
Full
Full
Full
Full
25
°
C
3.3 V CMOS
IV
IV
IV
IV
V
2.0
–0.3
5.0
+0.8
10
10
V
V
μ
A
μ
A
pF
1
0
4
LOGIC OUTPUTS
Logic Compatibility
Logic “1” Voltage (I
OH
= 0.25 mA)
Logic “0” Voltage (I
OL
= 0.25 mA)
IDD SUPPLY CURRENT
CLK = 104 MHz, VDD = 2.75 V
*
CLK = 104 MHz, VDDIO = 3.6 V
*
GSM Example: CORE
I/O
IS-136 Example: CORE
I/O
WBCDMA Example
Sleep Mode
Full
Full
Full
3.3 V CMOS/TTL
VDD – 0.2
0.2
IV
IV
2.0
V
V
0.4
Full
Full
IV
IV
V
422
193
232
56
207
55
Tbd
Tbd
TBD
*
mA
mA
mA
mA
mA
mA
mA
mA
V
V
IV
Full
TBD
POWER DISSIPATION
GSM Example
IS-136 Example
WBCDMA Example
Sleep Mode
V
V
V
IV
740
700
Tbd
Tbd
mW
mW
mW
mW
Full
TBD
*
This specification denotes an absolute maximum supply current for the device. The conditions include all channels active, minimum interpolation in both CIC
stages, and maximum switching of input data. In an actual application the power will be less.
See the Thermal Management section of the data sheet for further details.
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|---|---|
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD6623S/PCB | 制造商:Analog Devices 功能描述:4-CH, 104 MSPS DGTL TRANSMIT SGNL PROCESSOR (TSP) 28SOIC - Bulk |
| AD6624 | 制造商:AD 制造商全称:Analog Devices 功能描述:Four-Channel, 80 MSPS Digital Receive Signal Processor (RSP) |
| AD6624A | 制造商:AD 制造商全称:Analog Devices 功能描述:Four-Channel, 100 MSPS Digital Receive Signal Processor (RSP) |
| AD6624AABC | 制造商:Advanced Micro Devices 功能描述: |
| AD6624AABCZ | 功能描述:DIGITAL SIGNAL PROC 196 CSP-BGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
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