参数资料
型号: AD9785-DPG2-EBZ
厂商: Analog Devices Inc
文件页数: 59/64页
文件大小: 0K
描述: BOARD EVALUATION FOR AD9785
标准包装: 1
系列: TxDAC®
DAC 的数量: 2
位数: 12
采样率(每秒): 800M
数据接口: 串行
设置时间: 22ms
DAC 型: 电流
工作温度: -40°C ~ 85°C
已供物品: 板,缆线,CD
已用 IC / 零件: AD9785
AD9785/AD9787/AD9788
Rev. A | Page 62 of 64
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
1
25
26
50
76
100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
26
50
76
100
75
51
6.50
NOM
3.5°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
12
07
-A
NOTES:
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION
OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE,
WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
3. θJA: 27.4°C/W WITH THERMAL PAD UNSOLDERED, 19.1°C/W WITH THERMAL PAD SOLDERED TO PCB.
Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
40
C to +85C
100-Lead TQFP_EP
SV-100-1
AD9785BSVZRL1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
Evaluation Board
Evaluation Board
Evaluation Board
1 RoHS Compliant Part.
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