参数资料
型号: ADSP-BF535PBBZ-200
厂商: Analog Devices Inc
文件页数: 30/44页
文件大小: 0K
描述: IC DSP CONTROLLER 16BIT 260-BGA
产品培训模块: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
标准包装: 1
系列: Blackfin®
类型: 定点
接口: PCI,SPI,SSP,UART,USB
时钟速率: 200MHz
非易失内存: 外部
芯片上RAM: 308kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.50V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 260-BBGA
供应商设备封装: 260-PBGA(19x19)
包装: 托盘
ADSP-BF535
–36–
REV. A
Output Drive Currents
Figure 19 through Figure 21 show typical current-voltage char-
acteristics for the output drivers of the ADSP-BF535 Blackfin
processor. The curves represent the current drive capability of
the output drivers as a function of output voltage. Figure 19
applies to the
ABE3–0, SDQM3–0, ADDR25–2, AMS3–0,
AOE, ARE, AWE, CLKOUT, SCLK1, DATA31–0, DT1–0,
EMU, MISO1–0, MOSI1–0, PF15–0, RFS1–0, RSCLK1–0,
SA10,
SCAS, SCK1–0, SCKE, SCLK0, DEEPSLEEP,
SMS3–0, SRAS, SUSPEND, SWE, TDO, TFS1–0, TMR2–0,
TSCLK1–0, TX1–0, TXDMNS, TXDPLS,
TXEN, and
XTAL0 pins. Figure 20 applies to the PCI_AD31–0,
PCI_CBE3–0, PCI_DEVSEL, PCI_FRAME, PCI_INTA,
PCI_IRDY, PCI_PAR, PCI_PERR, PCI_RST, PCI_SERR,
PCI_STOP, and PCI_TRDY pins. Figure 21 applies to the
PCI_REQ pin.
Power Dissipation
Total power dissipation has two components: one due to internal
circuitry (PINT) and one due to the switching of external output
drivers (P
EXT). Table 26 shows the power dissipation for internal
circuitry (VDDINT). Internal power dissipation is dependent on the
instruction execution sequence and the data operands involved.
Table 27 shows the power dissipation for the phase-locked loop
(PLL) circuitry (VDDPLL).
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on:
Maximum frequency (f0) at which all output pins can
switch during each cycle
Their load capacitance (C0) of all switching pins
Their voltage swing (V
DDEXT)
The external component is calculated using:
Figure 19. Output Drive Current
Figure 20. PCI 33 MHz Output Drive Current
200
150
100
50
0
100
150
200
50
VOH (VDDEXT = 3.45V, 40°C)
VOH (VDDEXT =3.45V, 0°C)
VOH (VDDEXT = 3.15V, +105°C)
VOH (VDDEXT = 2.5V, +85°C)
VOH (VDDEXT = 3.3V, +25°C)
VOL (VDDEXT = 3.3V, +25°C)
VOL (VDDEXT = 2.5V, +85°C)
VOL (VDDEXT =3.45V, 0°C)
VOL (VDDEXT = 3.15V, +105°C)
VOL (VDDEXT =3.45V, 40°C)
SOURCE (VO) VOLTAGE – V
0
3.5
0.5
1.0
1.5
2.0
2.5
3.0
4.0
S
O
U
R
C
E
(I
O
)
C
U
R
E
N
T
m
A
0
3.5
0.5
1.0
1.5
2.0
2.5
3.0
4.0
200
150
100
50
0
50
100
150
VOH (VDDEXT =3.3V, +25°C)
VOH (VDDEXT =2.5V,
+85°C)
VOH (VDDEXT =3.45V, 0°C)
VOH (VDDEXT = 3.15V, +105°C)
VOH (VDDEXT = 3.45V, 45°C)
VOL (VDDEXT = 3.3V, +25°C)
VOL (VDDEXT =2.5V, +85°C)
VOL (VDDEXT =3.45V,0°C)
VOL (VDDEXT = 3.15V, +105°C)
VOL (VDDEXT =3.45V, 45°C)
S
O
U
R
C
E
(I
O
)
C
U
R
E
N
T
m
A
SOURCE (VO) VOLTAGE – V
200
250
300
Figure 21. PCI_REQ Output Drive Current
Table 26. Internal Power Dissipation
Test Conditions
1
1 IDD data is specified for typical process parameters. All data at 25C.
Parameter
fCCLK =
100 MHz
VDDINT =
1.0 V
fCCLK =
200 MHz
VDDINT =
1.2 V
fCCLK =
300 MHz
VDDINT =
1.5 V
fCCLK =
350 MHz
VDDINT =
1.6 V
Unit
IDDTYP
2
2 Processor executing 75% dual Mac, 25% ADD with moderate data bus
activity.
96.0
206.0
387.0
498.0
mA
IDDEFR
3
3 Implementation of Enhanced Full Rate (EFR) GSM algorithm.
114.0
248.0
463.0
579.0
mA
IDDSLEEP
4
4 See the ADSP-BF535 Blackfin Processor Hardware Reference Manual for
definitions of Sleep and Deep Sleep operating modes.
15.0
29.0
52.0
62.0
mA
IDDDEEPSLEEP
4 4.0
5.0
8.2
9.8
mA
IDDRESET
5
5IDD is specified for when the device is in the reset state.
132.0
255.0
485.3
651.0
mA
SOURCE (VO) VOLTAGE – V
S
O
U
R
C
E
(I
O
)
C
U
R
E
N
T
m
A
0
3.5
0.5
1.0
1.5
2.0
2.5
3.0
4.0
200
150
100
50
0
50
100
150
200
VOH (VDDEXT =3.3V, +25°C)
VOH (VDDEXT = 2.5V, +85°C)
VOH (VDDEXT = 3.45V, 0°C)
VOH (VDDEXT = 3.15V,
+105°C)
VOH (VDDEXT =3.45V, 45°C)
VOL (VDDEXT = 3.3V, +25°C)
VOL (VDDEXT =2.5V, +85°C)
VOL (VDDEXT = 3.45V, 0°C)
VOL (VDDEXT = 3.15V, +105°C)
VOL (VDDEXT =3.45V, 45°C)
PEXT
VDDEXT
2
C
0
f
0
×
×
=
相关PDF资料
PDF描述
ADSP-21368KBPZ-2A IC DSP 32BIT 333MHZ 256-BGA
MC79M15CT IC REG LDO -15V .5A TO220AB
TLJR336M004R3000 CAP TANT 33UF 4V 20% 0805
VI-21T-CW-F4 CONVERTER MOD DC/DC 6.5V 100W
MC79M12CT IC REG LDO -12V .5A TO220AB
相关代理商/技术参数
参数描述
ADSPBF535PKB300 制造商:Analog Devices 功能描述:
ADSP-BF535PKB-300 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-BF535PKB-350 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-BF535PKB-C91 制造商:Analog Devices 功能描述:
ADSP-BF535PKBZ-300 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA